Industry Sessions

8:30 AM - 11:55 AM CT

IS01 - What Is the Next Killer Application for Wide Bandgap Semiconductors?

Industry Session Chair: – Power Q Consulting, Inc.

Industry Session Chair:

PSMA Session

8:30 AM - 8:55 AM CT

IS01.1 - Bi-Directional Switches BDS): enabling the next killer app for wide bandgap semiconductors

Industry Session Presenter: – Enphase

PSMA Session

8:55 AM - 9:20 AM CT

IS01.2 - Maximizing MVHV SiC Performance and Reliability with Advanced Power Device and Packaging Technologies for Mission-Critical Energy Infrastructure Applications

Industry Session Presenter: – Navitas Semiconductor

PSMA Session

9:20 AM - 9:45 AM CT

IS01.3 - Combo IceGaN (GaN-IGBT hybrid) revolutionizes performance in EV traction inverters

Industry Session Presenter: – Cambridge GaN Devices

PSMA Session

9:45 AM - 10:10 AM CT

IS01.4 - Powering Precision: The Wide Bandgap Revolution in Electrosurgery

Industry Session Presenter:

PSMA Session

10:40 AM - 11:05 AM CT

IS01.5 - New Killer App for Wide Bandgap: AI Datacenters

Industry Session Presenter: – Power Integrations

Industry Session Presenter:

PSMA Session

11:05 AM - 11:30 AM CT

IS01.6 - IS01.6 The Role of SiC in Enabling Efficient and Compact Next-Generation Power Conversion Systems for PV and BESS Application

Industry Session Presenter: – Infineon Technologies AG

PSMA Session

11:30 AM - 11:55 AM CT

IS01.7 - AI Datacenter Power Architecture with High-Voltage Bi-Diectional and Low-Voltage GaN devices

Industry Session Presenter: – Renesas

PSMA Session

8:30 AM - 11:55 AM CT

IS02 - AI and Digital Twins Transforming Power Device Innovation

Industry Session Chair: – onsemi

Industry Session Chair: – WattsButler LLC

Industry Session Chair: – PE-Systems GmbH

Student Session Assistant: – University of Arkansas

PSMA Session

8:30 AM - 8:55 AM CT

IS02.1 - Advanced analytics and AI to improve semiconductor cost and quality

Industry Session Presenter: – PDF Solutions INC

PSMA Session

8:55 AM - 9:20 AM CT

IS02.2 - AI assisted LDMOS development for BCD technology

Industry Session Presenter: – onsemi

PSMA Session

9:20 AM - 9:45 AM CT

IS02.3 - Bridging Test and Design: How AI Accelerates Power Electronics

Industry Session Presenter: – PE-Systems

PSMA Session

9:45 AM - 10:10 AM CT

IS02.4 - Automated Custom Thermal Model Generator: Seamless Integration of Compact Models in System-Level Simulation

Industry Session Presenter: – Infineon Technologies

Industry Session Presenter: – Infineon

PSMA Session

10:40 AM - 11:05 AM CT

IS02.5 - AI-Driven Digital Twins for Design, Characterization and Reliability of GaN and SiC Power Devices and Systems

Industry Session Presenter: – University of Stuttgart

11:05 AM - 11:30 AM CT

IS02.6 - AI Driven Reduced Order Modeling for Power Electronics

Industry Session Presenter: – AVL

Industry Session Presenter: – Mathworks

PSMA Session

11:30 AM - 11:55 AM CT

IS02.7 - Trends in Wide Bandgap Double Pulse Testing and the Role of AI in Accelerating Automation

Industry Session Presenter: – Tektronix Inc

Industry Session Presenter: – Tektronix

Industry Session Presenter: – PE-Systems GmbH

PSMA Session

8:30 AM - 11:55 AM CT

IS03 - Capacitor Circuit Design Essentials for Modern Challenges

Industry Session Chair: – YAGEO

Industry Session Chair: – Wurth Electronik

Student Session Assistant: – University Of Stuttgart, Institute For System Dynamics

PSMA Session

8:30 AM - 8:55 AM CT

IS03.1 - How Capacitors are qualified and how to interpret datasheet values

Industry Session Presenter: – Wurth Elektronik

PSMA Session

8:55 AM - 9:20 AM CT

IS03.2 - Optimized Material Selection for targeted Electrolytic Capacitor Designs

Industry Session Presenter: – CapXon Electronic Technology Co., Ltd.

PSMA Session

9:20 AM - 9:45 AM CT

IS03.3 - Cooling Considerations for an MLCC Array in a Resonant Power Converter

Industry Session Presenter: – KEMET Electronics Corporation

PSMA Session

9:45 AM - 10:10 AM CT

IS03.4 - Optimizing Modern Power:- The Role of Parasitics in High Performance Design

Industry Session Presenter: – Wurth Elektronik

PSMA Session

10:40 AM - 11:05 AM CT

IS03.5 - Trends in Power Applications versus Operational Life of Aluminum Electrolytic Capacitors — The Key is Thermal Management

Industry Session Presenter: – YAGEO

PSMA Session

11:05 AM - 11:30 AM CT

IS03.6 - High-Temperature Solid-State Metallized Polymer Capacitors for Power Processing Applications

Industry Session Presenter: – PolyCharge

PSMA Session

11:30 AM - 11:55 AM CT

IS03.7 - Switched-Capacitor Power ICs for Emerging Data Center Architectures

Industry Session Presenter: – Skycore Semiconductors

PSMA Session

8:30 AM - 11:55 AM CT

IS04 - 3D-Power Packaging for AI and its Application in Power Systems Optimization

Industry Session Chair: – Taiyo America, Inc.

Industry Session Chair: – ASE US, Inc

Industry Session Chair: – Bultitude Consulting LLC

Student Session Assistant: – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELab, 38000 Grenoble, France

PSMA Session

8:30 AM - 8:55 AM CT

IS04.1 - Silicon Capacitors for Improved Power Efficiency and Power Density: From the Grid to the Chip

Industry Session Presenter: – Murata

PSMA Session

8:55 AM - 9:20 AM CT

IS04.2 - Embedded Passives Design for AI Power Delivery

Industry Session Presenter: – Saras Micro Devices

PSMA Session

9:20 AM - 9:45 AM CT

IS04.3 - How AI/ML Workloads are Transforming Data Center Power and Cooling

Industry Session Presenter: – Google Cloud

PSMA Session

9:45 AM - 10:10 AM CT

IS04.4 - Power for AI-Data centers

Industry Session Presenter: – Infineon

PSMA Session

10:40 AM - 11:05 AM CT

IS04.5 - Exploring AI/ML in Power Electronics - Component Selection and Converter Topology Optimizations

Industry Session Presenter: – NC State University

PSMA Session

11:05 AM - 11:30 AM CT

IS04.6 - The Silent Enabler: WBG Power Technology & packages for the AI-HPC Revolution

Industry Session Presenter: – Nexperia

PSMA Session

11:30 AM - 11:55 AM CT

IS04.7 - Vertical Power Delivery Integration: Benefits and Trade-offs of Moving Beyond PCB Backside to In-package Solutions

Industry Session Presenter: – Empower Semiconductor

PSMA Session

8:30 AM - 11:55 AM CT

IS05 - Gate Drivers and their Applications

Industry Session Chair: – Infineon Technologies AG

Industry Session Chair: – Infineon Technologies

Student Session Assistant: – Robert Bosch GmbH & KU Leuven

8:30 AM - 8:55 AM CT

IS05.1 - Novel solution utilizing standard half-bridge gate drivers in high current high side bidirectional DC breaker applications

Industry Session Presenter: – Texas Instruments

8:55 AM - 9:20 AM CT

IS05.2 - Methods to control bootstrap overcharge in half-bridge gate driver ICs

Industry Session Presenter: – Texas Instruments

9:20 AM - 9:45 AM CT

IS05.3 - Gate driver features and considerations for bidirectional FETs in single-stage matrix converters

Industry Session Presenter: – Texas Instruments

9:45 AM - 10:10 AM CT

IS05.4 - Optimization of Double-Pulse Half-Bridge Operation in Traction Inverters Using a Novel High-Resolution Current-Mode Gate Driver

Industry Session Presenter: – Skyworks Solutions

Co-Author: – Skyworks Solutions

10:40 AM - 11:05 AM CT

IS05.5 - Adaptive Gate Strength Implementation for Reverse-Conducting Insulated Gate Bipolar Transistor Based Electric Vehicle Traction Inverter Applications

Industry Session Presenter: – BorgWarner

Co-Author: – BorgWarner

11:05 AM - 11:30 AM CT

IS05.6 - Mitigating False Turn-On in Power MOSFETs Using Current Mode Gate Drivers: Advancements in Gate Drive Control

Industry Session Presenter: – Skyworks Solutions

11:30 AM - 11:55 AM CT

IS05.7 - Decoding the isolated gate driver’s datasheet: Clarity beyond the bullet points

Industry Session Presenter: – Infineon Technologies AG

Co-Author: – Infineon technologies

8:30 AM - 11:55 AM CT

IS06 - The Future of Powering AI

Industry Session Chair: – Princeton University

Industry Session Chair: – UC Berkeley

11:05 AM - 11:30 AM CT

IS06.6 - The Future of Powering AI

Industry Session Presenter: – Infineon Technologies

8:30 AM - 8:55 AM CT

IS06.1 - Density, Efficiency and Transient Response: How to Achieve These in a Compute Dense Rack?

Industry Session Presenter: – Nvidia

8:55 AM - 9:20 AM CT

IS06.2 - Power Delivery for High-speed Die to Die Interconnects and Future 3D-ICs

Industry Session Presenter: – TSMC

9:20 AM - 9:45 AM CT

IS06.3 - Feeding 10000A TPU from +/-400V: Architecture, Challenge, Opportunities

Industry Session Presenter: – Google

9:45 AM - 10:10 AM CT

IS06.4 - Opportunities and Challenges in Vertical Power Delivery for AI ASICs

Industry Session Presenter: – Meta Platforms

10:40 AM - 11:05 AM CT

IS06.5 - Powering AI Chips: Your Last Innovation

Industry Session Presenter: – Texas Instruments

11:30 AM - 11:55 AM CT

IS06.7 - Efficient Power Delivery Solutions for 5KW GPUs

Industry Session Presenter: – Intel Corporation

8:30 AM - 11:55 AM CT

IS07 - Beyond Silicon: Integrated Wide Bandgap Power Solutions for Next-Generation Systems

Industry Session Chair: – iDEAL Semiconductor

Industry Session Chair:

Student Session Assistant: – The University of Alabama (UA)

PSMA Session

8:30 AM - 8:55 AM CT

IS07.1 - Utilizing D³GaN capabilities to optimize Automotive Traction Inverter performance and costs in electric vehicles

Industry Session Presenter: – VisIC Technologies Austria GmbH

PSMA Session

8:55 AM - 9:20 AM CT

IS07.2 - Accelerating GaN Adoption in Motor Drives with Monolithic ICeGaN™ Integration

Industry Session Presenter: – Cambridge GaN Devices

PSMA Session

9:20 AM - 9:45 AM CT

IS07.3 - A novel three-phase power micro-module for robotic hands

Industry Session Presenter: – Efficient Power Conversion

PSMA Session

9:45 AM - 10:10 AM CT

IS07.4 - Enabling High-Temperature Applications with Monolithic GaN IC Modules

Industry Session Presenter: – MinDCet NV

Co-Author: – MinDCet NV.

PSMA Session

10:40 AM - 11:05 AM CT

IS07.5 - 1250 V and 1700 V GaN Solutions for 800 VDC AI Data Centers

Industry Session Presenter: – Power Integrations

PSMA Session

11:05 AM - 11:30 AM CT

IS07.6 - High-Power GaN ICs Deliver Leading Efficiency and Power Density in 800V AI Data Center DC-DC Brick Solutions

Industry Session Presenter: – Navitas

PSMA Session

11:30 AM - 11:55 AM CT

IS07.7 - Maximizing GaN Benefits Through Integration

Industry Session Presenter: – TEXAS INSTRUMENTS

PSMA Session

8:30 AM - 11:55 AM CT

IS08 - AI Tools for More Efficient Power Electronics Design

Industry Session Chair: – PE-Systems GmbH

Industry Session Chair: – WattsButler LLC

Industry Session Chair: – onsemi

Student Session Assistant: – Nanyang Technological University

PSMA and PELS Joint Session

8:30 AM - 8:55 AM CT

IS08.1 - Repurposing Power Electronics into an AI Reservoir Model

Industry Session Presenter: – Aalborg University

PSMA and PELS Joint Session

8:55 AM - 9:20 AM CT

IS08.2 - Charting the Future: A Taxonomy of AI -Driven Power Electronics

Industry Session Presenter: – ORNL

PSMA and PELS Joint Session

9:20 AM - 9:45 AM CT

IS08.3 - Title TBD

PSMA and PELS Joint Session

9:45 AM - 10:10 AM CT

IS08.4 - AI in Power Electronics Development and Operation

Industry Session Presenter: – Volkswagen

PSMA and PELS Joint Session

10:40 AM - 11:05 AM CT

IS08.5 - AI at the Edge: Resource-Constrained Reinforcement Learning for Real-Time Control in Power Electronics

Industry Session Presenter: – University of Applied Sciences Kaiserslautern

PSMA and PELS Joint Session

11:05 AM - 11:30 AM CT

IS08.6 - Temporal Modeling for Proactive Reliability in Power Electronic Architectures

Industry Session Presenter: – Silicon Austria Labs

PSMA and PELS Joint Session

11:30 AM - 11:55 AM CT

IS08.7 - Physics-Informed Machine Learning for Power Electronics Design

Industry Session Presenter: – University of Arkansas

PSMA and PELS Joint Session

8:30 AM - 11:55 AM CT

IS09 - Simulation and Modelling of Power Electronics

Industry Session Chair: – AEI

Industry Session Chair: – ST Microelectronics

Student Session Assistant: – Nagoya University

8:30 AM - 8:55 AM CT

IS09.1 - Accelerating BLDC Motor Drive Design Using Analog & Digital Co-simulation

Industry Session Presenter: – Qorvo

8:55 AM - 9:20 AM CT

IS09.2 - Multi-Physics Transient Simulation Approach for Current Capability Assessment of Power modules

Industry Session Presenter: – Nexperia

9:20 AM - 9:45 AM CT

IS09.3 - Accurate Transformer Modeling for Reliable Power Converter Simulation

Industry Session Presenter: – Keysight Technologies

Co-Author: – Keysight

9:45 AM - 10:10 AM CT

IS09.4 - Validating 3D FEM Simulations with Measurements - The Case of Gapped Core and Multi-turn/Litz Wires

Industry Session Presenter: – TRAFOLO Engineering

Co-Author: – Ventspils University of Applied Sciences

Co-Author: – TRAFOLO

10:40 AM - 11:05 AM CT

IS09.5 - Simulation and Rapid Prototyping of Current Mode Controllers Implemented using MCUs

Industry Session Presenter: – Plexim

11:05 AM - 11:30 AM CT

IS09.6 - Reduced-Order Magnetics Modeling: Accelerating Power Electronics Design with FEA Insights

Industry Session Presenter: – Altair Engineering

11:30 AM - 11:55 AM CT

IS09.7 - Implementation of EOSS in PLECS Models for Accurate Loss Predictions in Soft-Switching Applications

Industry Session Presenter: – Wolfspeed

Co-Author: – Wolfspeed

8:30 AM - 11:55 AM CT

IS10 - Power Supplies for AI Servers

Industry Session Chair: – Infineon Technologies America

Industry Session Chair: – Apple

Student Session Assistant: – University of South Carolina

8:30 AM - 8:55 AM CT

IS10.1 - AI Server and Rack Scale Power Loss Analysis

Industry Session Presenter: – Intel

Co-Author: – Intel

9:20 AM - 9:45 AM CT

IS10.2 - Improving Transient Performance on Server and AI Applications

Industry Session Presenter: – Monolithic Power Systems (MPS)

9:45 AM - 10:10 AM CT

IS10.3 - Significance of Precise Power Measurement for Data Center Energy Efficiency

Industry Session Presenter: – ZES ZIMMER Electronic Systems GmbH - A Rohde & Schwarz Company

Co-Author: – Rohde & Schwarz GmbH & Co. KG

10:10 AM - 10:40 AM CT

IS10.4 - Hardware evaluation of non-isolated DC/DC converters for high-voltage Power-Backup-Units (PBUs) in AI Datacenter applications

Industry Session Presenter: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Austria AG

10:40 AM - 11:05 AM CT

IS10.5 - 12kW Power Supply for AI Server and Data Center Applications with 113 W/in3 and grid shaping function

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies Austria AG

11:05 AM - 11:30 AM CT

IS10.6 - 16kW Three-Phase PSU for AI Server and Data Center Applications with Energy Buffer

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies Austria AG

11:30 AM - 11:55 AM CT

IS10.7 - High voltage hot swap circuit design to enable 400V / 800VDC data center power delivery

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

8:30 AM - 11:55 AM CT

IS11 - Overcoming Technical and Manufacturing Challenges to Meet Market Demands

Industry Session Chair: – Wurth Elektronik

Industry Session Chair: – Würth Elektronik

Industry Session Chair: – PSMAIndependent Inventor

Student Session Assistant: – Dankook University

PSMA Session

8:30 AM - 8:55 AM CT

IS11.1 - Designing Bidirectional Power Stages: Topology & Control Impacts on Planar Magnetic Construction and Manufacturing

Industry Session Presenter: – Standex

PSMA Session

8:55 AM - 9:20 AM CT

IS11.2 - 3D Printing to Fabricate Bobbins and Other Passive Components

Industry Session Presenter: – NORWE

PSMA Session

9:20 AM - 9:45 AM CT

IS11.3 - The Hidden Challenges of Design Transformers for Dual Active Bridge Systems

Industry Session Presenter: – Hitachi Energy

Industry Session Presenter: – Universidad Politecnica de Madrid

PSMA Session

9:45 AM - 10:10 AM CT

IS11.4 - Low-Power and High-Power Transformer Solutions to Support the Power Delivery Network for AI in Data Centers

Industry Session Presenter: – Würth Elektronik Midcom

PSMA Session

10:40 AM - 11:05 AM CT

IS11.5 - Chanllenge in Implementing Automation & Robotics in Magnetics Manufacturing.

Industry Session Presenter: – ITG Electronics

PSMA Session

11:05 AM - 11:30 AM CT

IS11.6 - Voltage Rating of Metal Alloy Molded Inductors

Industry Session Presenter: – Würth Elektronik eiSos

PSMA Session

11:30 AM - 11:55 AM CT

IS11.7 - Customizable Magnetic Components for Next-Generation Power Electronics Using Nanocrystalline Flake Ribbon

Industry Session Presenter: – CBMM

PSMA Session

8:30 AM - 11:55 AM CT

IS12 - EV Power System Design Challenges

Industry Session Chair: – Infineon Technologies

Industry Session Chair: – Infineon

Student Session Assistant: – Dankook University

8:30 AM - 8:55 AM CT

IS12.1 - Single-stage converter with CoolGaN Bidirectional switch, a paradigm shift of EV on-board charger solutions

Industry Session Presenter: – Infineon Technologies Americas Corp.

Co-Author: – Infineon Semiconductors (Shenzhen) Company Limited

Co-Author: – Infineon Technologies Canada Inc

8:55 AM - 9:20 AM CT

IS12.2 - Understanding the transition from 12V to 48V low voltage rail for automotive systems

Industry Session Presenter: – Texas Instruments

9:20 AM - 9:45 AM CT

IS12.3 - Half the Cost, Full Performance: Innovative Approaches to EV On-Board Charger Design

Industry Session Presenter: – Schaeffler

9:45 AM - 10:10 AM CT

IS12.4 - Design and Implementation of a Bidirectional 11 kW CLLC Converter Using Smart SiC Switches for Automotive Applications

Industry Session Presenter: – Automotive Electrification at Analog Devices, Inc.

10:40 AM - 11:05 AM CT

IS12.5 - EV efficiency optimization through 15-level static and dynamic gate drive technologies for driving cycle

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

11:05 AM - 11:30 AM CT

IS12.6 - Automotive Power Modules: Packaging Choices and Cost Trade‑offs

Industry Session Presenter: – Yole Group

Co-Author: – Yole Group

11:30 AM - 11:55 AM CT

IS12.7 - Cybersecurity of Public EV-Charging Infrastructure: Lessons from 80,000 Stations in Germany and Implications for the U.S.

Industry Session Presenter: – Harz University of Applied Sciences

Co-Author: – Actain Engineering GmbH

1:30 PM - 4:55 PM CT

IS13 - New Era of Power Technologies, Devices, Topologies and Applications

Industry Session Chair: – Power Integrations

Industry Session Chair: – Infineon

Student Session Assistant: – The Pennsylvania State University

PSMA Session

1:30 PM - 1:55 PM CT

IS13.1 - Reverse Recovery Revisited for Wide-Bandgap Power transistors

Industry Session Presenter: – Infineon Technologies Americas Corp

PSMA Session

1:55 PM - 2:20 PM CT

IS13.2 - Leap Ahead with GaN Bidirectional Switches

Industry Session Presenter: – Renesas

PSMA Session

2:20 PM - 2:45 PM CT

IS13.3 - Advancements in SiC Power Devices: Device Design Roadmap to Next-Generation Energy and AI Applications

Industry Session Presenter: – Microchip

PSMA Session

2:45 PM - 3:10 PM CT

IS13.4 - 1250 V GaN HEMTs for High-Voltage AI Datacenter Architecture

Industry Session Presenter: – Power Integrations

PSMA Session

3:40 PM - 4:05 PM CT

IS13.5 - GaN High Power Modules – next level in Efficient & Ecological BEV Inverter Applications

Industry Session Presenter: – VisIC Technologies Austria GmbH

PSMA Session

4:05 PM - 4:30 PM CT

IS13.6 - Next generation inductive isolation based Solid State Relays open new electronic switching applications

Industry Session Presenter: – Infineon Technologies

PSMA Session

4:30 PM - 4:55 PM CT

IS13.7 - Benefits of integrated ZCD / ZVD feature in GaN devices for Triangular Current Mode (TCM) Totem Pole PFC

Industry Session Presenter: – Texas Instruments

PSMA Session

1:30 PM - 4:55 PM CT

IS14 - Power Circuit Design for Emerging Applications

Industry Session Chair: – Power Integrations Inc

Industry Session Chair: – Power Integrations

Student Session Assistant: – Auburn University

1:30 PM - 1:55 PM CT

IS14.1 - An Anti-Magnetic Tampering Quasi-Resonant Flyback SMPS for Energy Metering Applications

Industry Session Presenter: – Power Integrations

Co-Author: – Power Integrations

1:55 PM - 2:20 PM CT

IS14.2 - High voltage data center AC-DC trade offs

Industry Session Presenter: – Texas Instruments Inc

2:20 PM - 2:45 PM CT

IS14.3 - Design of a GaN-based single-switch forward converter with a loss-less passive reset for aerospace applications

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

2:45 PM - 3:10 PM CT

IS14.4 - High Efficient Bidirectional GaN based Single Stage Microinverter

Industry Session Presenter: – Renesas

Co-Author: – Renesas Electronics Corporation

3:40 PM - 4:05 PM CT

IS14.5 - How to design an efficient and cost effective 300W micro DC/DC converter with secondary side regulation for automotive applications

Industry Session Presenter: – Texas Instruments

4:05 PM - 4:30 PM CT

IS14.6 - A SiC-Based 33kW Bi-directional Single Phase ANPC Converter with High Efficiency

Industry Session Presenter: – Wolfspeed

Co-Author: – Wolfspeed

Co-Author: – 1811

4:30 PM - 4:55 PM CT

IS14.7 - Design of AC-DC Matrix Converters with Bidirectional GaNs for OBC Applications

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

1:30 PM - 4:55 PM CT

IS15 - Tools and Automation for Design and Testing

Industry Session Chair: – Cyient Semiconductors

Industry Session Chair: – Cyient Semiconductor

Student Session Assistant: – University of Colorado Boulder

1:30 PM - 1:55 PM CT

IS15.1 - Design and optimization of an automated double-pulse-test setup for WBG power devices with self-adjusting deskew

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies AG

1:55 PM - 2:20 PM CT

IS15.2 - Verifying Traction Inverter Robustness Against Manufacturing Tolerances Using Motor Emulation

Industry Session Presenter: – AVL Test Systems, Inc.

2:20 PM - 2:45 PM CT

IS15.3 - Automated Calibration Framework for Double Pulse Testing of WBG Devices

Industry Session Presenter: – NA

Co-Author: – Tektronix India Private Limited

Co-Author: – NA

Co-Author: – Tektronix Inc

2:45 PM - 3:10 PM CT

IS15.4 - AI-Driven Parasitic Filtering of shunt current measurement for WBG characterisation

Industry Session Presenter: – Tektronix India Private Limited

Co-Author: – NA

Co-Author: – Tektronix Inc

3:40 PM - 4:05 PM CT

IS15.5 - Mitigating Extra Eddy Currents Losses in HF Transformers’ Aluminium Housing: A Physical-Based Study with Thermal Analysis.

Industry Session Presenter: – Bourns Electronics

Co-Author: – Bourns Electronics

4:05 PM - 4:30 PM CT

IS15.6 - Hot Topic: Intuitive Semiconductor Thermal Loss Estimation for System-Level Design

Industry Session Presenter: – Plexim, Inc.

4:30 PM - 4:55 PM CT

IS15.7 - Lessons Learned Converting High-Fidelity Switching Models of Resonant Converters into AI-Based Reduced Order Models for System-Level Simulations

Industry Session Presenter: – Siemens

Co-Author: – Siemens

1:30 PM - 4:55 PM CT

IS16 - Power Converter Circuits and Topologies

Industry Session Chair: – Texas Instruments

Industry Session Chair: – TI

Student Session Assistant: – University of North Carolina at Charlotte

1:30 PM - 1:55 PM CT

IS16.1 - High efficiency and high density 3.3kW Server GaN PSU based on Auxiliary Resonant Commutated Pole Totem Pole PFC

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies Austria AG

1:55 PM - 2:20 PM CT

IS16.2 - Understanding Inductor and flyback transformer datasheet specifications and characteristics

Industry Session Presenter: – Premier Magnetics

2:20 PM - 2:45 PM CT

IS16.3 - Bidirectional GaN Switch Half Bridge Building Block for Next Generation Power Converters

Industry Session Presenter: – Renesas

Co-Author: – Renesas

2:45 PM - 3:10 PM CT

IS16.4 - Optimized Component Selection for Multi-Stage Power Conversion Systems

Industry Session Presenter: – Altair

3:40 PM - 4:05 PM CT

IS16.5 - Compact GaN-Based 5 kW Four-Level Totem-Pole PFC Converter

Industry Session Presenter: – Efficient Power Conversion

Co-Author: – Efficient Power Conversion Corporation

Co-Author: – Efficient Power Conversion

Co-Author: – Microchip Technology

4:05 PM - 4:30 PM CT

IS16.6 - A CCM/TCM Multi-mode Controlled Totem-pole Bridgeless PFC

Industry Session Presenter: – Texas Instruments Inc

4:30 PM - 4:55 PM CT

IS16.7 - Achieving High Power Factor, Low THD, Single-Stage Design with Low Output Ripple Using Switched Valley Fill Flyback Topology

Industry Session Presenter: – Power Integrations

1:30 PM - 4:55 PM CT

IS17 - Markets and Technology Evolution

Industry Session Chair: – Analog Devices

Industry Session Chair: – Wired & Wireless Technologies (WAWT)

Student Session Assistant: – University of Tennessee

1:30 PM - 1:55 PM CT

IS17.1 - Power Architecture evolution in Datacenters

Industry Session Presenter: – Renesas

1:55 PM - 2:20 PM CT

IS17.2 - From SiC Adoption to Supply Chain Realignment: The Future of Power Electronics for xEVs

Industry Session Presenter: – Yole Group

2:20 PM - 2:45 PM CT

IS17.3 - Evolution of Higher Power Racks - Path to 1MW and beyond

Industry Session Presenter: – Advanced Energy

2:45 PM - 3:10 PM CT

IS17.4 - Safeguarding Your Valuable IP: Protecting AI Innovations and Innovations Developed with the Assistance of AI

Industry Session Presenter: – Rothwell, Figg, Ernst & Manbeck, P.C.

3:40 PM - 4:05 PM CT

IS17.5 - Powering the Kilowatt-Class AI Processors Era: A State-of-the-Industry Review of Scalable Power Delivery Solutions for Compute Platforms

Industry Session Presenter: – Empower Semiconductor

4:05 PM - 4:30 PM CT

IS17.6 - From Fast Chargers to Datacenters: The Expanding Role of GaN in Power Electronics

Industry Session Presenter: – Yole group

Co-Author: – Yole group

1:30 PM - 4:55 PM CT

IS18 - Wide Bandgap Power Devices

Industry Session Chair: – Texas Instruments

Industry Session Chair: – Power Integrations

Student Session Assistant: – University of Washington

1:30 PM - 1:55 PM CT

IS18.1 - Optimizing Soft-switching Operation of GaN at High Frequency

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies

Co-Author: – Infineon Technologies America

Co-Author: – Infineon Technologies Austria

1:55 PM - 2:20 PM CT

IS18.2 - Reexamination of MOSFET Hard Switching Losses in Application for Si and GaN Devices

Industry Session Presenter: – iDEAL Semiconductors

2:20 PM - 2:45 PM CT

IS18.3 - SiC JFET Super Cascode for High Voltage Semiconductor Circuit Breakers

Industry Session Presenter: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Austria AG

2:45 PM - 3:10 PM CT

IS18.4 - Improvement of SiC MOSFETs body diode Qrr up to 30% through semiconductor substrate engineering

Industry Session Presenter: – Soitec

3:40 PM - 4:05 PM CT

IS18.5 - Forced Current Quasistatic C-V Technique for SiC Devices

Industry Session Presenter: – Keithley Instruments / Tektronix

Co-Author: – Tektronix

4:05 PM - 4:30 PM CT

IS18.6 - Design and Reliability Validation of SiC MOSFET Modules Utilizing Body Diodes for Industrial Applications

Industry Session Presenter: – Mitsubishi Electric US, Inc.

4:30 PM - 4:55 PM CT

IS18.7 - Optimal Efficiency Enabled by SiC MOSFET in Induction Heating

Industry Session Presenter: – Infineon Technologies Americas Corp.

Co-Author: – Infineon Technologies Americas Corp.

8:20 AM - 10:00 AM CT

IS19 - Improving Energy Efficiency and Availability Part 1

Industry Session Chair: – Power Integrations

Industry Session Chair: – MEAN WELL Power Solutions

Industry Session Chair: – Tyndall National Institute

Student Session Assistant: – Indian Institute of Technology Madras

PSMA Session

8:20 AM - 8:45 AM CT

IS19.1 - Efficiency in Low-Power Isolated DC-DC Conversion for Interface and Gate Drive Supplies

Industry Session Presenter: – RECOM

PSMA Session

8:45 AM - 9:10 AM CT

IS19.2 - Grid-Forming Batteries

Industry Session Presenter: – Sandia National Labs

PSMA Session

9:10 AM - 9:35 AM CT

IS19.3 - Making Next-Gen AI Data Centers More Available and Efficient by Improving SiC Short-Circuit Ruggedness

Industry Session Presenter: – NoMIS Power Group

PSMA Session

9:35 AM - 10:00 AM CT

IS19.4 - The Role of Long Duration Energy Storage to Decarbonise and Establish Energy Security

Industry Session Presenter: – IERC

PSMA Session

8:20 AM - 10:00 AM CT

IS20 - Magnetic Materials for Existing and Emerging Applications Part 1

Industry Session Chair: – Wurth Elektronik

Industry Session Chair: – PSMAIndependent Inventor

Industry Session Chair: – Würth Elektronik

Student Session Assistant: – Indian Institute of Technology, Bombay

PSMA Session

8:20 AM - 8:45 AM CT

IS20.1 - Relevant Magnetic Material Properties for Existing and Emerging Applications

Industry Session Presenter: – Coburg Universiy of Applied Sciences and Arts

PSMA Session

8:45 AM - 9:10 AM CT

IS20.2 - Metal Chip Power Inductor for IVR Applications: High Performance with Customizable Flexibility

Industry Session Presenter: – TAIYO YUDEN Co. Ltd.

PSMA Session

9:10 AM - 9:35 AM CT

IS20.3 - Magnetic/Resin Composite Sheets for High-Frequency Power Electronics: From Fundamental Properties to Packaging Integration Challenges

Industry Session Presenter: – Ajinomoto Fine-Techno Co., Inc.

PSMA Session

9:35 AM - 10:00 AM CT

IS20.4 - Superparamagnetic Nanocomposites for Power Electronic Applications

Industry Session Presenter: – Sandia National Laboratories

Industry Session Presenter: – Sandia National Labs

PSMA Session

8:20 AM - 10:00 AM CT

IS21 - Power Modules and Packaging

Industry Session Chair: – Advanced Energy

Industry Session Chair: – Qorvo

Student Session Assistant: – IIT Bhubaneswar

8:20 AM - 8:45 AM CT

IS21.1 - Enabling miniaturization and higher efficiency in low voltage motor drives through semiconductor integration and flip chip power packaging

Industry Session Presenter: – Texas Instruments

8:45 AM - 9:10 AM CT

IS21.2 - PCB Design Considerations and Stack-up for 40 kVA Assembled Power Modules (700 VDC, 45 A)

Industry Session Presenter: – Semikron Danfoss Elektronik GmbH & Co. KG

Co-Author: – Semikron Danfoss LLC

9:10 AM - 9:35 AM CT

IS21.3 - Ceramics Substrates for Next Generation Heat Dissipation from Electric Devices

Industry Session Presenter: – NORITAKE U.S.A., INC., Industrial Ceramics Department

Co-Author: – NORITAKE CO., LIMITED, Sales Department, Ceramics and Material Division

9:35 AM - 10:00 AM CT

IS21.4 - Power Electronics Integration and Manufacturing-Power Modules / High Density Design

Industry Session Presenter: – ICP Technology

Co-Author: – Sentec E&E

8:20 AM - 10:00 AM CT

IS22 - USB Power Delivery

Industry Session Chair: – Texas Instruments

Industry Session Chair: – onsemi

8:20 AM - 8:45 AM CT

IS22.1 - Thermal-efficient USB-PD charging in automotive systems: embracing the 48 VIN standard

Industry Session Presenter: – Texas Instruments Inc.

8:45 AM - 9:10 AM CT

IS22.2 - Elevating 140W Fast-Charging Adapter Design to a New Level with the Improved ZVS Flyback and Totem-Pole PFC Solution

Industry Session Presenter: – Monolithic Power Systems

Co-Author: – MPS

9:10 AM - 9:35 AM CT

IS22.3 - A self-biasing, auxless sensing GaN-based Flyback converter for USB-PD adapters

Industry Session Presenter: – TEXAS INSTRUMENTS

Co-Author: – TEXAS INSTRUMENTS

9:35 AM - 10:00 AM CT

IS22.4 - Firmware Optimizations to Enhance Light-Load Efficiency in USB-PD Adapters

Industry Session Presenter: – Power Integrations Inc.

8:20 AM - 10:00 AM CT

IS23 - Reliability: From Stress to Strength: Physics-Based Reliability for Next-Generation GaN Power Systems

Industry Session Chair: – L3HARRIS TECHNOLOGIES

Industry Session Chair: – STSM – Power Technology and Qualification

Student Session Assistant: – Auburn University

PSMA Session

8:20 AM - 8:45 AM CT

IS23.1 - Mission Profile-driven Reliability Assessment of Leading-edge GaN for AI Data Center Applications

Industry Session Presenter: – EPC Co.

PSMA Session

8:45 AM - 9:10 AM CT

IS23.2 - Smart Motors: Harnessing Sensor Data and AI for Predictive Maintenance

Industry Session Presenter: – STSM – Power Technology and Qualification

Industry Session Presenter: – IBM

PSMA Session

9:10 AM - 9:35 AM CT

IS23.3 - Electronics in a Deep Ocean Environment. Effects of Pressure on Electronics and Things to Consider During the Design Phase

Industry Session Presenter: – University of South Carolina

PSMA Session

9:35 AM - 10:00 AM CT

IS23.4 - Joint GaN Technology Study

Industry Session Presenter: – IBM

PSMA Session

8:20 AM - 10:00 AM CT

IS24 - Pairing Capacitors with Inductors to Create Better Solutions

Industry Session Chair: – YAGEO

Industry Session Chair: – Würth Elektronik

Student Session Assistant: – Indian Institute of Technology Delhi

PSMA Session

8:20 AM - 8:45 AM CT

IS24.1 - A Practical Design Guide for resonant Power Conversion

Industry Session Presenter: – YAGEO Group

PSMA Session

8:45 AM - 9:10 AM CT

IS24.2 - The Importance of Magnetic Components in EMC Filter

Industry Session Presenter: – TE Connectivity - Schaffner

PSMA Session

9:10 AM - 9:35 AM CT

IS24.3 - EMI Filter Success - Smart Inductor Selection

Industry Session Presenter: – Würth Elektronik

PSMA Session

9:35 AM - 10:00 AM CT

IS24.4 - Performance of Common-Mode Chokes with Enhanced Differential-Mode Inductance in EMI Filters Including Capacitive Interactions

Industry Session Presenter: – Utah State University

PSMA Session

10:20 AM - 12:00 PM CT

IS25 - Improving Energy Efficiency and Availability Part 2

Industry Session Chair: – Power Integrations

Industry Session Chair: – MEAN WELL Power Solutions

Industry Session Chair: – Tyndall National Institute

Student Session Assistant: – Indian Institute of Technology Delhi

PSMA Session

10:20 AM - 10:45 AM CT

IS25.1 - Single-Stage Resonant Converter for High-Efficiency EV Charging

Industry Session Presenter: – Power Integrations

PSMA Session

10:45 AM - 11:10 AM CT

IS25.2 - The Energy Harvesting Sweet Spot for Self-Powering Wireless Sensor Nodes

Industry Session Presenter: – Tyndall National Institute

PSMA Session

11:10 AM - 11:35 AM CT

IS25.3 - Centralized Power Distribution and Higher Efficiency for System Benefits

Industry Session Presenter: – MEAN WELL Power Solutions

PSMA Session

11:35 AM - 12:00 PM CT

IS25.4 - Using DC-Based Solutions to Enable Fast-Deployed, Scalable, Modular Data Centers to Drive Unprecedented Densities, Efficiency, Optimization, and Enablement

Industry Session Presenter: – PowerRox

PSMA Session

10:20 AM - 12:00 PM CT

IS26 - Magnetic Materials for Existing and Emerging Applications Part 2

Industry Session Chair: – Wurth Elektronik

Industry Session Chair: – Würth Elektronik

Industry Session Chair: – PSMAIndependent Inventor

Student Session Assistant: – University of Pennsylvania

PSMA Session

10:20 AM - 10:45 AM CT

IS26.1 - Multi-Cut Nanocrystalline Cores Through Classical Modeling

Industry Session Presenter: – MK Magnetics

PSMA Session

10:45 AM - 11:10 AM CT

IS26.2 - Nanocrystalline Cores for EMI Applications

Industry Session Presenter: – Magnetec GmbH

PSMA Session

11:10 AM - 11:35 AM CT

IS26.3 - Role of Nb in Nanocrystalline Ribbon and Core Manufacturing

Industry Session Presenter: – CBMM

PSMA Session

11:35 AM - 12:00 PM CT

IS26.4 - Fe-based Nanocrystalline Alloys for Power Choke Applications

Industry Session Presenter: – Yageo Group / KEMET Electronics

PSMA Session

10:20 AM - 12:00 PM CT

IS27 - Commercial Monolithic Bidirectional Switches are Here. Are They Ready for Adoption in Your Power Converter Products?

Industry Session Chair: – PowerAmerica

Industry Session Chair: – University of Wisconsin-Madison

Student Session Assistant: – University of North Carolina at Charlotte

10:20 AM - 10:45 AM CT

IS27.1 - The Benefits of Monolithic GaN Bidirectional Switch for Hard and Soft-switching Single-stage Converters

Industry Session Presenter: – Infineon Technologies Americas Corp

10:45 AM - 11:10 AM CT

IS27.2 - B-TRAN® Bidirectional High-Power Switch Enabling Solid-State Circuit Breakers and EV Contactors

Industry Session Presenter: – Ideal Power

11:10 AM - 11:35 AM CT

IS27.3 - Dual-Stage to Single-Stage: GaN BDS Enabling the Next Leap in Power Design

Industry Session Presenter: – Renesas

11:35 AM - 11:50 AM CT

IS27.4 - Single-stage Power Converter Enabled by GaN Bidirectional Switches

Industry Session Presenter: – Navitas

10:20 AM - 12:00 PM CT

IS28 - Power Converter Control Circuits and Algorithms

Industry Session Chair: – Infineon Technologies Austria AG

Industry Session Chair: – Texas Instruments

10:20 AM - 10:45 AM CT

IS28.1 - High Power Density and High Efficiency GaN-based PFC for Server and Telecom

Industry Session Presenter: – STMicroelectronics S.r.l.

Co-Author: – STMicroelectronics S.r.l.

Co-Author: – University of Catania

10:45 AM - 11:10 AM CT

IS28.2 - Single MCU based control solution for single-stage isolated AC/DC PFC rectifiers with direct matrix converter topology

Industry Session Presenter: – Texas Instruments Inc.

Co-Author: – Texas Instruments Inc.

11:10 AM - 11:35 AM CT

IS28.3 - Digital centric DCDC with low complexity analog circuit and linear regulation mode

Industry Session Presenter: – STMIcroelectronics

11:35 AM - 11:50 AM CT

IS28.4 - A Construct Method for Designing Digital Power Controllers with Examples and Tools

Industry Session Presenter: – North Atlantic Industries

10:20 AM - 12:00 PM CT

IS29 - Standards and Compliance for Power Supplies

Industry Session Chair: – Dekra

Industry Session Chair: – NC State University

Student Session Assistant: – Indian Institute of Technology Madras

10:20 AM - 10:45 AM CT

IS29.1 - What it takes to make an IEC60601 Medical Power Supply

Industry Session Presenter: – Advanced Energy

10:45 AM - 11:10 AM CT

IS29.2 - Compliance Feasibility Study - A User-Friendly EMC Test Result Simulation and EMI Filtering Solution Design Tool

Industry Session Presenter: – University of Florida

Co-Author: – University of Florida

Co-Author: – ITG Electronics

11:10 AM - 11:35 AM CT

IS29.3 - Multimodal Agent for EMI-Aware PCB Design Verification and Diagnosis

Industry Session Presenter: – University of Florida

Co-Author: – University of Florida

Co-Author: – ITG Electronics

11:35 AM - 11:50 AM CT

IS29.4 - Beyond the Plug: Meeting Product Safety Under IEC 60335-1 and Minimizing Standby Power Consumption

Industry Session Presenter: – Power Integrations, Inc.

Co-Author: – Power Integrations, Inc.

10:20 AM - 12:00 PM CT

IS30 - Vertical Power for AI Data Centers

Industry Session Chair: – Amber Semiconductor, Inc. (AmberSemi)

Student Session Assistant: – University of Colorado Boulder

10:20 AM - 10:40 AM CT

IS30.1 - AI Power: Why Traditional Delivery is Breaking Down

Industry Session Presenter: – Amber Semiconductor, Inc. (AmberSemi)

10:40 AM - 11:00 AM CT

IS30.2 - Challenges in AI Datacenters & Solution Requirements for Vertical Power Architectures

Industry Session Presenter: – AMD

11:00 AM - 11:20 AM CT

IS30.3 - Silicon Technology and the Process Integration Path for Vertical Power

Industry Session Presenter: – GlobalFoundries

11:20 AM - 11:40 AM CT

IS30.4 - Advancing Magnetic Designs for High Density Designs

Industry Session Presenter: – NVIDIA

11:40 AM - 12:00 PM CT

IS30.5 - Technological Advancements Driving Power Density for Vertical Power

Industry Session Presenter: – Amber Semiconductor, Inc. (AmberSemi)