Industry Sessions

8:30 AM - 11:55 AM CT

IS01 - What Is the Next Killer Application for Wide Bandgap Semiconductors?

Industry Session Chair: – Power Q Consulting, Inc.

Industry Session Chair:

Student Session Assistant: – KU Leuven - Energyville

PSMA Session

8:30 AM - 8:55 AM CT

IS01.1 - Bi-Directional Switches BDS): enabling the next killer app for wide bandgap semiconductors

Industry Session Presenter: – Enphase

PSMA Session

8:55 AM - 9:20 AM CT

IS01.2 - Maximizing MVHV SiC Performance and Reliability with Advanced Power Device and Packaging Technologies for Mission-Critical Energy Infrastructure Applications

Industry Session Presenter: – Navitas Semiconductor

PSMA Session

9:20 AM - 9:45 AM CT

IS01.3 - Combo IceGaN (GaN-IGBT hybrid) revolutionizes performance in EV traction inverters

Industry Session Presenter: – Cambridge GaN Devices

PSMA Session

9:45 AM - 10:10 AM CT

IS01.4 - Powering Precision: The Wide Bandgap Revolution in Electrosurgery

Industry Session Presenter:

PSMA Session

10:40 AM - 11:05 AM CT

IS01.5 - New Killer App for Wide Bandgap: AI Datacenters

Industry Session Presenter: – Power Integrations

Industry Session Presenter:

PSMA Session

11:05 AM - 11:30 AM CT

IS01.6 - IS01.6 The Role of SiC in Enabling Efficient and Compact Next-Generation Power Conversion Systems for PV and BESS Application

Industry Session Presenter: – Infineon Technologies AG

PSMA Session

11:30 AM - 11:55 AM CT

IS01.7 - AI Datacenter Power Architecture with High-Voltage Bi-Diectional and Low-Voltage GaN devices

Industry Session Presenter: – Renesas

PSMA Session

8:30 AM - 11:55 AM CT

IS02 - AI and Digital Twins Transforming Power Device Innovation

Industry Session Chair: – onsemi

Industry Session Chair: – WattsButler LLC

Industry Session Chair: – PE-Systems GmbH

Student Session Assistant: – University of Arkansas

PSMA Session

8:30 AM - 8:55 AM CT

IS02.1 - Advanced analytics and AI to improve semiconductor cost and quality

Industry Session Presenter: – PDF Solutions INC

PSMA Session

8:55 AM - 9:20 AM CT

IS02.2 - AI assisted LDMOS development for BCD technology

Industry Session Presenter: – onsemi

PSMA Session

9:20 AM - 9:45 AM CT

IS02.3 - Bridging Test and Design: How AI Accelerates Power Electronics

Industry Session Presenter: – PE-Systems

PSMA Session

9:45 AM - 10:10 AM CT

IS02.4 - Automated Custom Thermal Model Generator: Seamless Integration of Compact Models in System-Level Simulation

Industry Session Presenter: – Infineon Technologies

Industry Session Presenter: – Infineon

PSMA Session

10:40 AM - 11:05 AM CT

IS02.5 - AI-Driven Digital Twins for Design, Characterization and Reliability of GaN and SiC Power Devices and Systems

Industry Session Presenter: – University of Stuttgart

PSMA Session

11:05 AM - 11:30 AM CT

IS02.6 - AI Driven Reduced Order Modeling for Power Electronics

Industry Session Presenter: – AVL

Industry Session Presenter: – Mathworks

PSMA Session

11:30 AM - 11:55 AM CT

IS02.7 - Trends in Wide Bandgap Double Pulse Testing and the Role of AI in Accelerating Automation

Industry Session Presenter: – Tektronix Inc

Industry Session Presenter: – Tektronix

Industry Session Presenter: – PE-Systems GmbH

PSMA Session

8:30 AM - 11:55 AM CT

IS03 - Capacitor Circuit Design Essentials for Modern Challenges

Industry Session Chair: – YAGEO

Industry Session Chair: – Wurth Electronik

Student Session Assistant: – University Of Stuttgart, Institute For System Dynamics

PSMA Session

8:30 AM - 8:55 AM CT

IS03.1 - How Capacitors are qualified and how to interpret datasheet values

Industry Session Presenter: – Wurth Elektronik

PSMA Session

8:55 AM - 9:20 AM CT

IS03.2 - Optimized Material Selection for targeted Electrolytic Capacitor Designs

Industry Session Presenter: – CapXon Electronic Technology Co., Ltd.

PSMA Session

9:20 AM - 9:45 AM CT

IS03.3 - Cooling Considerations for an MLCC Array in a Resonant Power Converter

Industry Session Presenter: – KEMET Electronics Corporation

PSMA Session

9:45 AM - 10:10 AM CT

IS03.4 - Optimizing Modern Power:- The Role of Parasitics in High Performance Design

Industry Session Presenter: – Wurth Elektronik

PSMA Session

10:40 AM - 11:05 AM CT

IS03.5 - Trends in Power Applications versus Operational Life of Aluminum Electrolytic Capacitors — The Key is Thermal Management

Industry Session Presenter: – YAGEO

PSMA Session

11:05 AM - 11:30 AM CT

IS03.6 - High-Temperature Solid-State Metallized Polymer Capacitors for Power Processing Applications

Industry Session Presenter: – PolyCharge

PSMA Session

11:30 AM - 11:55 AM CT

IS03.7 - Switched-Capacitor Power ICs for Emerging Data Center Architectures

Industry Session Presenter: – Skycore Semiconductors

PSMA Session

8:30 AM - 11:55 AM CT

IS04 - 3D-Power Packaging for AI and its Application in Power Systems Optimization

Industry Session Chair: – Taiyo America, Inc.

Industry Session Chair: – ASE US, Inc

Industry Session Chair: – Bultitude Consulting LLC

Student Session Assistant: – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELab, 38000 Grenoble, France

PSMA Session

8:30 AM - 8:55 AM CT

IS04.1 - Silicon Capacitors for Improved Power Efficiency and Power Density: From the Grid to the Chip

Industry Session Presenter: – Murata

PSMA Session

8:55 AM - 9:20 AM CT

IS04.2 - Embedded Passives Design for AI Power Delivery

Industry Session Presenter: – Saras Micro Devices

PSMA Session

9:20 AM - 9:45 AM CT

IS04.3 - How AI/ML Workloads are Transforming Data Center Power and Cooling

Industry Session Presenter: – Google Cloud

PSMA Session

9:45 AM - 10:10 AM CT

IS04.4 - Power for AI-Data centers

Industry Session Presenter: – Infineon

PSMA Session

10:40 AM - 11:05 AM CT

IS04.5 - Exploring AI/ML in Power Electronics - Component Selection and Converter Topology Optimizations

Industry Session Presenter: – NC State University

PSMA Session

11:05 AM - 11:30 AM CT

IS04.6 - The Silent Enabler: WBG Power Technology & packages for the AI-HPC Revolution

Industry Session Presenter: – Nexperia

PSMA Session

11:30 AM - 11:55 AM CT

IS04.7 - Vertical Power Delivery Integration: Benefits and Trade-offs of Moving Beyond PCB Backside to In-package Solutions

Industry Session Presenter: – Empower Semiconductor

Co-Author: – Empower Semiconductor

PSMA Session

8:30 AM - 11:55 AM CT

IS05 - Gate Drivers and their Applications

Industry Session Chair: – Infineon Technologies AG

Industry Session Chair: – Infineon Technologies

Student Session Assistant: – Robert Bosch GmbH & KU Leuven

8:30 AM - 8:55 AM CT

IS05.1 - Novel solution utilizing standard half-bridge gate drivers in high current high side bidirectional DC breaker applications

Industry Session Presenter: – Texas Instruments

8:55 AM - 9:20 AM CT

IS05.2 - Methods to control bootstrap overcharge in half-bridge gate driver ICs

Industry Session Presenter: – Texas Instruments

9:20 AM - 9:45 AM CT

IS05.3 - Gate driver features and considerations for bidirectional FETs in single-stage matrix converters

Industry Session Presenter: – Texas Instruments

9:45 AM - 10:10 AM CT

IS05.4 - Optimization of Double-Pulse Half-Bridge Operation in Traction Inverters Using a Novel High-Resolution Current-Mode Gate Driver

Industry Session Presenter: – Skyworks Solutions

Co-Author: – Skyworks Solutions

10:40 AM - 11:05 AM CT

IS05.5 - Adaptive Gate Strength Implementation for Reverse-Conducting Insulated Gate Bipolar Transistor Based Electric Vehicle Traction Inverter Applications

Industry Session Presenter: – BorgWarner

Co-Author: – BorgWarner

11:05 AM - 11:30 AM CT

IS05.6 - Mitigating False Turn-On in Power MOSFETs Using Current Mode Gate Drivers: Advancements in Gate Drive Control

Industry Session Presenter: – Skyworks Solutions

11:30 AM - 11:55 AM CT

IS05.7 - Decoding the isolated gate driver’s datasheet: Clarity beyond the bullet points

Industry Session Presenter: – Infineon Technologies AG

Co-Author: – Infineon technologies

8:30 AM - 11:55 AM CT

IS06 - The Future of Powering AI

Industry Session Chair: – Princeton University

Industry Session Chair: – UC Berkeley

Student Session Assistant: – Indian Institute of Technology Bombay

11:05 AM - 11:30 AM CT

IS06.6 - The Future of Powering AI

Industry Session Presenter: – Infineon Technologies

8:30 AM - 8:55 AM CT

IS06.1 - Density, Efficiency and Transient Response: How to Achieve These in a Compute Dense Rack?

Industry Session Presenter: – Nvidia

8:55 AM - 9:20 AM CT

IS06.2 - Power Delivery for High-speed Die to Die Interconnects and Future 3D-ICs

Industry Session Presenter: – TSMC

9:20 AM - 9:45 AM CT

IS06.3 - Feeding 10000A TPU from +/-400V: Architecture, Challenge, Opportunities

Industry Session Presenter: – Google

9:45 AM - 10:10 AM CT

IS06.4 - Opportunities and Challenges in Vertical Power Delivery for AI ASICs

Industry Session Presenter: – Meta Platforms

10:40 AM - 11:05 AM CT

IS06.5 - Powering AI Chips: Your Last Innovation

Industry Session Presenter: – Texas Instruments

11:30 AM - 11:55 AM CT

IS06.7 - Efficient Power Delivery Solutions for 5KW GPUs

Industry Session Presenter: – Intel Corporation