Industry Sessions

8:30 AM - 11:55 AM CT

IS07 - Beyond Silicon: Integrated Wide Bandgap Power Solutions for Next-Generation Systems

Industry Session Chair: – Efficient Power Conversion (EPC)

Industry Session Chair: – Cambridge GaN Devices

8:30 AM - 11:55 AM CT

IS08 - AI Tools for More Efficient Power Electronics Design

Industry Session Chair: – PE-Systems GmbH

Industry Session Chair: – WattsButler LLC

Industry Session Chair: – onsemi

8:30 AM - 11:55 AM CT

Simulation and Modelling of Power Electronics

Industry Session Chair: – AEI

Industry Session Chair: – ST Microelectronics

8:30 AM - 8:55 AM CT

IS09.1 - Accelerating BLDC Motor Drive Design Using Analog & Digital Co-simulation

Industry Session Presenter: – Qorvo

8:55 AM - 9:20 AM CT

IS09.2 - Multi-Physics Transient Simulation Approach for Current Capability Assessment of Power modules

Industry Session Presenter: – Nexperia

9:20 AM - 9:45 AM CT

IS09.3 - Accurate Transformer Modeling for Reliable Power Converter Simulation

Industry Session Presenter: – Keysight Technologies

Co-Author: – Keysight

9:45 AM - 10:10 AM CT

IS09.4 - Validating 3D FEM Simulations with Measurements - The Case of Gapped Core and Multi-turn/Litz Wires

Industry Session Presenter: – TRAFOLO Engineering

Co-Author: – Ventspils University of Applied Sciences

Co-Author: – TRAFOLO

10:40 AM - 11:05 AM CT

IS09.5 - Simulation and Rapid Prototyping of Current Mode Controllers Implemented using MCUs

Industry Session Presenter: – Plexim

11:05 AM - 11:30 AM CT

IS09.6 - Reduced-Order Magnetics Modeling: Accelerating Power Electronics Design with FEA Insights

Industry Session Presenter: – Altair Engineering

11:30 AM - 11:55 AM CT

IS09.7 - Implementation of EOSS in PLECS Models for Accurate Loss Predictions in Soft-Switching Applications

Industry Session Presenter: – Wolfspeed

Co-Author: – Wolfspeed

8:30 AM - 11:55 AM CT

Power Supplies for AI Servers

Industry Session Chair: – Infineon Technologies America

Industry Session Chair: – Apple

8:30 AM - 8:55 AM CT

IS10.1 - AI Server and Rack Scale Power Loss Analysis

Industry Session Presenter: – Intel

Co-Author: – Intel

9:20 AM - 9:45 AM CT

IS10.2 - Improving Transient Performance on Server and AI Applications

Industry Session Presenter: – Monolithic Power Systems (MPS)

9:45 AM - 10:10 AM CT

IS10.3 - Significance of Precise Power Measurement for Data Center Energy Efficiency

Industry Session Presenter: – ZES ZIMMER Electronic Systems Gmbh

Co-Author: – Rohde & Schwarz GmbH & Co. KG

10:10 AM - 10:40 AM CT

IS10.4 - Hardware evaluation of non-isolated DC/DC converters for high-voltage Power-Backup-Units (PBUs) in AI Datacenter applications

Industry Session Presenter: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Austria AG

10:40 AM - 11:05 AM CT

IS10.5 - 12kW Power Supply for AI Server and Data Center Applications with 113 W/in3 and grid shaping function

Industry Session Presenter: – Infineon Technologies Nordic AB

Co-Author: – Infineon Technologies Austria AG

11:05 AM - 11:30 AM CT

IS10.6 - 16kW Three-Phase PSU for AI Server and Data Center Applications with Energy Buffer

Industry Session Presenter: – Infineon Technologies Nordic AB

Co-Author: – Infineon Technologies Austria AG

11:30 AM - 11:55 AM CT

IS10.7 - High voltage hot swap circuit design to enable 400V / 800VDC data center power delivery

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

8:30 AM - 11:55 AM CT

IS11 - Overcoming Technical and Manufacturing Challenges to Meet Market Demands

Industry Session Chair: – Wurth Elektronik

Industry Session Chair: – Würth Elektronik

Industry Session Chair: – Independent Inventor

8:30 AM - 11:55 AM CT

EV Power System Design Challenges

Industry Session Chair: – Infineon Technologies

Industry Session Chair: – Infineon

8:30 AM - 8:55 AM CT

IS12.1 - Single-stage converter with CoolGaN Bidirectional switch, a paradigm shift of EV on-board charger solutions

Industry Session Presenter: – Infineon Technologies Americas Corp.

Co-Author: – Infineon Semiconductors (Shenzhen) Company Limited

Co-Author: – Infineon Technologies Canada Inc

8:55 AM - 9:20 AM CT

IS12.2 - Understanding the transition from 12V to 48V low voltage rail for automotive systems

Industry Session Presenter: – Texas Instruments

9:20 AM - 9:45 AM CT

IS12.3 - Half the Cost, Full Performance: Innovative Approaches to EV On-Board Charger Design

Industry Session Presenter: – Schaeffler

9:45 AM - 10:10 AM CT

IS12.4 - Design and Implementation of a Bidirectional 11 kW CLLC Converter Using Smart SiC Switches for Automotive Applications

Industry Session Presenter: – Automotive Electrification at Analog Devices, Inc.

10:40 AM - 11:05 AM CT

IS12.5 - EV efficiency optimization through 15-level static and dynamic gate drive technologies for driving cycle

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

11:05 AM - 11:30 AM CT

IS12.6 - Automotive Power Modules: Packaging Choices and Cost Trade‑offs

Industry Session Presenter: – Yole Group

Co-Author: – Yole Group

11:30 AM - 11:55 AM CT

IS12.7 - Cybersecurity of Public EV-Charging Infrastructure: Lessons from 80,000 Stations in Germany and Implications for the U.S.

Industry Session Presenter: – Harz University of Applied Sciences

Co-Author: – Actain Engineering GmbH

1:30 PM - 4:55 PM CT

IS13 - New era of Power technologies, Devices, Topologies and applications

Industry Session Chair: – Power Integrations

Industry Session Chair: – Infineon

1:30 PM - 4:55 PM CT

Power Circuit Design for Emerging Applications

Industry Session Chair: – Power Integrations Inc

Industry Session Chair: – Power Integrations

1:30 PM - 1:55 PM CT

IS14.1 - An Anti-Magnetic Tampering Quasi-Resonant Flyback SMPS for Energy Metering Applications

Industry Session Presenter: – Power Integrations

Co-Author: – Power Integrations

1:55 PM - 2:20 PM CT

IS14.2 - High voltage data center AC-DC trade offs

Industry Session Presenter: – Texas Instruments Inc

2:20 PM - 2:45 PM CT

IS14.3 - Design of a GaN-based single-switch forward converter with a loss-less passive reset for aerospace applications

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

2:45 PM - 3:10 PM CT

IS14.4 - High Efficient Bidirectional GaN based Single Stage Microinverter

Industry Session Presenter: – Renesas Electronics Corporation

Co-Author: – Renesas

3:40 PM - 4:05 PM CT

IS14.5 - How to design an efficient and cost effective 300W micro DC/DC converter with secondary side regulation for automotive applications

Industry Session Presenter: – Texas Instruments

4:05 PM - 4:30 PM CT

IS14.6 - A SiC-Based 33kW Bi-directional Single Phase ANPC Converter with High Efficiency

Industry Session Presenter: – Wolfspeed

Co-Author: – Wolfspeed

Co-Author: – 1811

4:30 PM - 4:55 PM CT

IS14.7 - Design of AC-DC Matrix Converters with Bidirectional GaNs for OBC Applications

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

1:30 PM - 4:55 PM CT

Tools and Automation for Design and Testing

Industry Session Chair: – Wolfspeed

1:30 PM - 1:55 PM CT

IS15.1 - Design and optimization of an automated double-pulse-test setup for WBG power devices with self-adjusting deskew

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies AG

1:55 PM - 2:20 PM CT

IS15.2 - Verifying Traction Inverter Robustness Against Manufacturing Tolerances Using Motor Emulation

Industry Session Presenter: – AVL Test Systems, Inc.

2:20 PM - 2:45 PM CT

IS15.3 - Automated Calibration Framework for Double Pulse Testing of WBG Devices

Industry Session Presenter: – NA

Co-Author: – Tektronix India Private Limited

Co-Author: – NA

Co-Author: – Tektronix Inc

2:45 PM - 3:10 PM CT

IS15.4 - AI-Driven Parasitic Filtering of shunt current measurement for WBG characterisation

Industry Session Presenter: – Tektronix India Private Limited

Co-Author: – NA

Co-Author: – Tektronix Inc

3:40 PM - 4:05 PM CT

IS15.5 - Mitigating Extra Eddy Currents Losses in HF Transformers’ Aluminium Housing: A Physical-Based Study with Thermal Analysis.

Industry Session Presenter: – Bourns Electronics

Co-Author: – Bourns Electronics

4:05 PM - 4:30 PM CT

IS15.6 - Hot Topic: Intuitive Semiconductor Thermal Loss Estimation for System-Level Design

Industry Session Presenter: – Plexim, Inc.

4:30 PM - 4:55 PM CT

IS15.7 - Lessons Learned Converting High-Fidelity Switching Models of Resonant Converters into AI-Based Reduced Order Models for System-Level Simulations

Industry Session Presenter: – Altair Engineering

Co-Author: – Siemens

1:30 PM - 4:55 PM CT

Power Converter Circuits and Topologies

Industry Session Chair: – Texas Instruments

Industry Session Chair: – TI

1:30 PM - 1:55 PM CT

IS16.1 - High efficiency and high density 3.3kW Server GaN PSU based on Auxiliary Resonant Commutated Pole Totem Pole PFC

Industry Session Presenter: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Nordic AB

1:55 PM - 2:20 PM CT

IS16.2 - Understanding Inductor and flyback transformer datasheet specifications and characteristics

Industry Session Presenter: – Premier Magnetics

2:20 PM - 2:45 PM CT

IS16.3 - Bidirectional GaN Switch Half Bridge Building Block for Next Generation Power Converters

Industry Session Presenter: – Renesas

Co-Author: – Renesas

2:45 PM - 3:10 PM CT

IS16.4 - Optimized Component Selection for Multi-Stage Power Conversion Systems

Industry Session Presenter: – Altair

3:40 PM - 4:05 PM CT

IS16.5 - Compact GaN-Based 5 kW Four-Level Totem-Pole PFC Converter

Industry Session Presenter: – Efficient Power Conversion

Co-Author: – Efficient Power Conversion Corporation

Co-Author: – Efficient Power Conversion

Co-Author: – Microchip Technology

4:05 PM - 4:30 PM CT

IS16.6 - A CCM/TCM Multi-mode Controlled Totem-pole Bridgeless PFC

Industry Session Presenter: – Texas Instruments Inc

4:30 PM - 4:55 PM CT

IS16.7 - Achieving High Power Factor, Low THD, Single-Stage Design with Low Output Ripple Using Switched Valley Fill Flyback Topology

Industry Session Presenter: – Power Integrations

1:30 PM - 4:55 PM CT

Markets and Technology Evolution

Industry Session Chair: – Texas Instruments

Industry Session Chair: – Wired & Wireless Technologies (WAWT)

1:30 PM - 1:55 PM CT

IS17.1 - Power Architecture evolution in Datacenters

Industry Session Presenter: – Renesas

1:55 PM - 2:20 PM CT

IS17.2 - From SiC Adoption to Supply Chain Realignment: The Future of Power Electronics for xEVs

Industry Session Presenter: – Yole Group

2:20 PM - 2:45 PM CT

IS17.3 - Evolution of Higher Power Racks - Path to 1MW and beyond

Industry Session Presenter: – Advanced Energy

2:45 PM - 3:10 PM CT

IS17.4 - Safeguarding Your Valuable IP: Protecting AI Innovations and Innovations Developed with the Assistance of AI

Industry Session Presenter:

3:40 PM - 4:05 PM CT

IS17.5 - Powering the Kilowatt-Class AI Processors Era: A State-of-the-Industry Review of Scalable Power Delivery Solutions for Compute Platforms

Industry Session Presenter: – Empower Semiconductor

4:05 PM - 4:30 PM CT

IS17.6 - From Fast Chargers to Datacenters: The Expanding Role of GaN in Power Electronics

Industry Session Presenter: – Yole group

Co-Author: – Yole group

4:30 PM - 4:55 PM CT

IS17.7 - The threats and opportunities for power semiconductor vendors in an evolving EV landscape

Industry Session Presenter: – Omdia

1:30 PM - 4:55 PM CT

Wide Bandgap Power Devices

Industry Session Chair: – Texas Instruments

Industry Session Chair:

1:30 PM - 1:55 PM CT

IS18.1 - Optimizing Soft-switching Operation of GaN at High Frequency

Industry Session Presenter: – Infineon Technologies

Co-Author: – Infineon Technologies

Co-Author: – Infineon Technologies America

Co-Author: – Infineon Technologies Austria

1:55 PM - 2:20 PM CT

IS18.2 - Reexamination of MOSFET Hard Switching Losses in Application for Si and GaN Devices

Industry Session Presenter: – iDEAL Semiconductors

2:20 PM - 2:45 PM CT

IS18.3 - SiC JFET Super Cascode for High Voltage Semiconductor Circuit Breakers

Industry Session Presenter: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Austria AG

2:45 PM - 3:10 PM CT

IS18.4 - Improvement of SiC MOSFETs body diode Qrr up to 30% through semiconductor substrate engineering

Industry Session Presenter: – Soitec

3:40 PM - 4:05 PM CT

IS18.5 - Forced Current Quasistatic C-V Technique for SiC Devices

Industry Session Presenter: – Tektronix

Co-Author: – Tektronix

4:05 PM - 4:30 PM CT

IS18.6 - Design and Reliability Validation of SiC MOSFET Modules Utilizing Body Diodes for Industrial Applications

Industry Session Presenter: – Mitsubishi Electric US, Inc.

4:30 PM - 4:55 PM CT

IS18.7 - Optimal Efficiency Enabled by SiC MOSFET in Induction Heating

Industry Session Presenter: – Infineon Technologies Americas Corp.

Co-Author: – Infineon Technologies Americas Corp.