Industry Sessions

8:20 AM - 10:00 AM CT

IS19 - Improving Energy Efficiency and Availability Part 1

Location: 212

Industry Session Chair: – Power Integrations

Industry Session Chair: – MEAN WELL Power Solutions

Industry Session Chair: – Tyndall National Institute

Student Session Assistant: – Indian Institute of Technology Madras

PSMA Session

8:20 AM - 8:45 AM CT

IS19.1 - Efficiency in Low-Power Isolated DC-DC Conversion for Interface and Gate Drive Supplies

Location: 212

Industry Session Presenter: – RECOM

PSMA Session

8:45 AM - 9:10 AM CT

IS19.2 - Grid-Forming Batteries

Location: 212

Industry Session Presenter: – Sandia National Labs

PSMA Session

9:10 AM - 9:35 AM CT

IS19.3 - Making Next-Gen AI Data Centers More Available and Efficient by Improving SiC Short-Circuit Ruggedness

Location: 212

Industry Session Presenter: – NoMIS Power

PSMA Session

9:35 AM - 10:00 AM CT

IS19.4 - The Role of Long Duration Energy Storage to Decarbonise and Establish Energy Security

Location: 212

Industry Session Presenter: – Tyndall National Institute

Co-Author: – Tyndall National Institute

PSMA Session

8:20 AM - 10:00 AM CT

IS20 - Magnetic Materials for Existing and Emerging Applications Part 1

Location: 213

Industry Session Chair: – Wurth Elektronik

Industry Session Chair: – Würth Elektronik

Student Session Assistant: – Indian Institute of Technology, Bombay

PSMA Session

8:20 AM - 8:45 AM CT

IS20.1 - Relevant Magnetic Material Properties for Existing and Emerging Applications

Location: 213

Industry Session Presenter: – Coburg Universiy of Applied Sciences and Arts

PSMA Session

8:45 AM - 9:10 AM CT

IS20.2 - Metal Chip Power Inductor for IVR Applications: High Performance with Customizable Flexibility

Location: 213

Industry Session Presenter: – TAIYO YUDEN Co. Ltd.

PSMA Session

9:10 AM - 9:35 AM CT

IS20.3 - Magnetic/Resin Composite Sheets for High-Frequency Power Electronics: From Fundamental Properties to Packaging Integration Challenges

Location: 213

Industry Session Presenter: – Ajinomoto Fine-Techno Co., Inc.

PSMA Session

9:35 AM - 10:00 AM CT

IS20.4 - Superparamagnetic Nanocomposites for Power Electronic Applications

Location: 213

Industry Session Presenter: – Sandia National Laboratories

Industry Session Presenter: – Sandia National Labs

PSMA Session

8:20 AM - 10:00 AM CT

IS21 - Power Modules and Packaging

Location: 206

Industry Session Chair: – Advanced Energy

Industry Session Chair: – Qorvo

Student Session Assistant: – IIT Bhubaneswar

8:20 AM - 8:45 AM CT

IS21.1 - Enabling miniaturization and higher efficiency in low voltage motor drives through semiconductor integration and flip chip power packaging

Location: 206

Industry Session Presenter: – Texas Instruments

8:45 AM - 9:10 AM CT

IS21.2 - PCB Design Considerations and Stack-up for 40 kVA Assembled Power Modules (700 VDC, 45 A)

Location: 206

Industry Session Presenter: – Semikron Danfoss Elektronik GmbH & Co. KG

Co-Author: – Semikron Danfoss LLC

9:10 AM - 9:35 AM CT

IS21.3 - Ceramics Substrates for Next Generation Heat Dissipation from Electric Devices

Location: 206

Industry Session Presenter: – NORITAKE CO.,LIMITED

Co-Author: – NORITAKE U.S.A., INC., Industrial Ceramics Department

Co-Author: – NORITAKE CO., LIMITED, Sales Department, Ceramics and Material Division

9:35 AM - 10:00 AM CT

IS21.4 - Power Electronics Integration and Manufacturing-Power Modules / High Density Design

Location: 206

Industry Session Presenter: – ICP Technology

Co-Author: – Sentec E&E

8:20 AM - 10:00 AM CT

IS22 - USB Power Delivery

Location: 207

Industry Session Chair: – Texas Instruments

Industry Session Chair: – onsemi

Student Session Assistant: – University of Maryland, College Park

8:20 AM - 8:45 AM CT

IS22.1 - Thermal-efficient USB-PD charging in automotive systems: embracing the 48 VIN standard

Location: 207

Industry Session Presenter: – Texas Instruments Inc.

8:45 AM - 9:10 AM CT

IS22.2 - Elevating 140W Fast-Charging Adapter Design to a New Level with the Improved ZVS Flyback and Totem-Pole PFC Solution

Location: 207

Industry Session Presenter: – Monolithic Power Systems

Co-Author: – MPS

9:10 AM - 9:35 AM CT

IS22.3 - A self-biasing, auxless sensing GaN-based Flyback converter for USB-PD adapters

Location: 207

Industry Session Presenter: – TEXAS INSTRUMENTS

Co-Author: – TEXAS INSTRUMENTS

9:35 AM - 10:00 AM CT

IS22.4 - Firmware Optimizations to Enhance Light-Load Efficiency in USB-PD Adapters

Location: 207

Industry Session Presenter: – Power Integrations Inc.

8:20 AM - 10:00 AM CT

IS23 - Reliability: From Stress to Strength: Physics-Based Reliability for Next-Generation GaN Power Systems

Location: 210

Industry Session Chair: – AdaClock

Industry Session Chair: – IBM

Student Session Assistant: – Auburn University

PSMA Session

8:20 AM - 8:45 AM CT

IS23.1 - Mission Profile-driven Reliability Assessment of Leading-edge GaN for AI Data Center Applications

Location: 210

Industry Session Presenter: – EPC Co.

PSMA Session

8:45 AM - 9:10 AM CT

IS23.2 - Engineering Reliability in Critical High-Voltage Power Applications

Location: 210

Industry Session Presenter: – XP Power

PSMA Session

9:10 AM - 9:35 AM CT

IS23.3 - Electronics in a Deep Ocean Environment. Effects of Pressure on Electronics and Things to Consider During the Design Phase

Location: 210

Industry Session Presenter: – Sensors & Systems Solutions, LLC; University of South Carolina

PSMA Session

9:35 AM - 10:00 AM CT

IS23.4 - Joint GaN Technology Study

Location: 210

Industry Session Presenter: – IBM

PSMA Session

8:20 AM - 10:00 AM CT

IS24 - Pairing Capacitors with Inductors to Create Better Solutions

Location: 205

Industry Session Chair: – YAGEO

Industry Session Chair: – Würth Elektronik

Student Session Assistant: – Indian Institute of Technology Delhi

PSMA Session

8:20 AM - 8:45 AM CT

IS24.1 - A Practical Design Guide for resonant Power Conversion

Location: 205

Industry Session Presenter: – YAGEO Group

PSMA Session

8:45 AM - 9:10 AM CT

IS24.2 - The Importance of Magnetic Components in EMC Filter

Location: 205

Industry Session Presenter: – TE Connectivity - Schaffner

PSMA Session

9:10 AM - 9:35 AM CT

IS24.3 - EMI Filter Success - Smart Inductor Selection

Location: 205

Industry Session Presenter: – Würth Elektronik

PSMA Session

9:35 AM - 10:00 AM CT

IS24.4 - Performance of Common-Mode Chokes with Enhanced Differential-Mode Inductance in EMI Filters Including Capacitive Interactions

Location: 205

Industry Session Presenter: – Utah State University

PSMA Session

10:20 AM - 12:00 PM CT

IS25 - Improving Energy Efficiency and Availability Part 2

Location: 212

Industry Session Chair: – Power Integrations

Industry Session Chair: – MEAN WELL Power Solutions

Industry Session Chair: – Tyndall National Institute

Student Session Assistant: – Indian Institute of Technology Delhi

PSMA Session

10:20 AM - 10:45 AM CT

IS25.1 - Single-Stage Resonant Converter for High-Efficiency EV Charging

Location: 212

Industry Session Presenter: – Power Integrations

PSMA Session

10:45 AM - 11:10 AM CT

IS25.2 - The Energy Harvesting Sweet Spot for Self-Powering Wireless Sensor Nodes

Location: 212

Industry Session Presenter: – Tyndall National Institute

PSMA Session

11:10 AM - 11:35 AM CT

IS25.3 - Centralized Power Distribution and Higher Efficiency for System Benefits

Location: 212

Industry Session Presenter: – MEAN WELL Power Solutions

PSMA Session

11:35 AM - 12:00 PM CT

IS25.4 - Using DC-Based Solutions to Enable Fast-Deployed, Scalable, Modular Data Centers to Drive Unprecedented Densities, Efficiency, Optimization, and Enablement

Location: 212

Industry Session Presenter: – PowerRox

PSMA Session

10:20 AM - 12:00 PM CT

IS26 - Magnetic Materials for Existing and Emerging Applications Part 2

Location: 213

Industry Session Chair: – Wurth Elektronik

Industry Session Chair: – Würth Elektronik

Student Session Assistant: – University of Pennsylvania

PSMA Session

10:20 AM - 10:45 AM CT

IS26.1 - Multi-Cut Nanocrystalline Cores Through Classical Modeling

Location: 213

Industry Session Presenter: – MK Magnetics

PSMA Session

10:45 AM - 11:10 AM CT

IS26.2 - Nanocrystalline Cores for EMI Applications

Location: 213

Industry Session Presenter: – Magnetec GmbH

PSMA Session

11:10 AM - 11:35 AM CT

IS26.3 - Role of Nb in Nanocrystalline Ribbon and Core Manufacturing

Location: 213

Industry Session Presenter: – CBMM

PSMA Session

11:35 AM - 12:00 PM CT

IS26.4 - Fe-based Nanocrystalline Alloys for Power Choke Applications

Location: 213

Industry Session Presenter: – Yageo Group / KEMET Electronics

PSMA Session

10:20 AM - 12:00 PM CT

IS27 - Commercial Monolithic Bidirectional Switches are Here. Are They Ready for Adoption in Your Power Converter Products?

Location: 206

Industry Session Chair: – PowerAmerica

Industry Session Chair: – University of Wisconsin-Madison

Student Session Assistant: – University of North Carolina at Charlotte

10:20 AM - 10:45 AM CT

IS27.1 - The Benefits of Monolithic GaN Bidirectional Switch for Hard and Soft-switching Single-stage Converters

Location: 206

Industry Session Presenter: – Infineon Technologies Americas Corp

10:45 AM - 11:10 AM CT

IS27.2 - B-TRAN® Bidirectional High-Power Switch Enabling Solid-State Circuit Breakers and EV Contactors

Location: 206

Industry Session Presenter: – Ideal Power

11:10 AM - 11:35 AM CT

IS27.3 - Dual-Stage to Single-Stage: GaN BDS Enabling the Next Leap in Power Design

Location: 206

Industry Session Presenter: – Renesas

Industry Session Presenter: – Renesas Electronics

11:35 AM - 12:00 PM CT

IS27.4 - Single-stage Power Converter Enabled by GaN Bidirectional Switches

Location: 206

Industry Session Presenter: – Navitas Semiconductor

Co-Author: – Navitas

10:20 AM - 12:00 PM CT

IS28 - Power Converter Control Circuits and Algorithms

Location: 207

Industry Session Chair: – Texas Instruments

Industry Session Chair: – Power Integrations

Student Session Assistant: – University of Maryland, College Park

10:20 AM - 10:45 AM CT

IS28.1 - High Power Density and High Efficiency GaN-based PFC for Server and Telecom

Location: 207

Industry Session Presenter: – STMicroelectronics S.r.l.

Co-Author: – STMicroelectronics S.r.l.

Co-Author: – University of Catania

10:45 AM - 11:10 AM CT

IS28.2 - Single MCU based control solution for single-stage isolated AC/DC PFC rectifiers with direct matrix converter topology

Location: 207

Industry Session Presenter: – Texas Instruments Inc.

Co-Author: – Texas Instruments Inc.

11:10 AM - 11:35 AM CT

IS28.3 - Digital centric DCDC with low complexity analog circuit and linear regulation mode

Location: 207

Industry Session Presenter: – STMIcroelectronics

11:35 AM - 11:50 AM CT

IS28.4 - A Construct Method for Designing Digital Power Controllers with Examples and Tools

Location: 207

Industry Session Presenter: – North Atlantic Industries

10:20 AM - 12:00 PM CT

IS29 - Standards and Compliance for Power Supplies

Location: 210

Industry Session Chair: – Dekra

Industry Session Chair: – NC State University

Student Session Assistant: – Indian Institute of Technology Madras

10:20 AM - 10:45 AM CT

IS29.1 - What it takes to make an IEC60601 Medical Power Supply

Location: 210

Industry Session Presenter: – Advanced Energy

10:45 AM - 11:10 AM CT

IS29.2 - Compliance Feasibility Study - A User-Friendly EMC Test Result Simulation and EMI Filtering Solution Design Tool

Location: 210

Industry Session Presenter: – ITG Electronics

Co-Author: – University of Florida

11:10 AM - 11:35 AM CT

IS29.3 - Multimodal Agent for EMI-Aware PCB Design Verification and Diagnosis

Location: 210

Industry Session Presenter: – University of Florida

Co-Author: – University of Florida

Co-Author: – ITG Electronics

11:35 AM - 11:50 AM CT

IS29.4 - Beyond the Plug: Meeting Product Safety Under IEC 60335-1 and Minimizing Standby Power Consumption

Location: 210

Industry Session Presenter: – Power Integrations, Inc.

Co-Author: – Power Integrations, Inc.

10:20 AM - 12:00 PM CT

IS30 - Vertical Power for AI Data Centers

Location: 205

Industry Session Chair: – Amber Semiconductor, Inc. (AmberSemi)

Student Session Assistant: – University of Colorado Boulder

10:20 AM - 10:40 AM CT

IS30.1 - AI Power: Why Traditional Delivery is Breaking Down

Location: 205

Industry Session Presenter: – Amber Semiconductor, Inc. (AmberSemi)

10:40 AM - 11:00 AM CT

IS30.2 - Challenges in AI Datacenters & Solution Requirements for Vertical Power Architectures

Location: 205

Industry Session Presenter: – AMD

11:00 AM - 11:20 AM CT

IS30.3 - Advancing Magnetic Designs for High Density Designs

Location: 205

Industry Session Presenter: – NVIDIA

11:20 AM - 11:40 AM CT

IS30.4 - Silicon Technology and the Process Integration Path for Vertical Power

Location: 205

Industry Session Presenter: – GlobalFoundries

11:40 AM - 12:00 PM CT

IS30.5 - Technological Advancements Driving Power Density for Vertical Power

Location: 205

Industry Session Presenter: – Amber Semiconductor, Inc. (AmberSemi)