Exhibitor Presentations

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Wednesday, March 25, 2026
12:00 PM - 12:30 PM CT
EX - MEMS-Based HV Smart Circuit Protection
Location: 214D
Exhibitor Presenter: John Mookken (he/him/his) – Menlo Microsystems
Exhibitor Presenter: Michael House, MS, MBA – Siemens Government Technologies
Presented By
12:00 PM - 12:30 PM CT
EX - Multi-Level Converters for Battery Charging
Location: Expo Theater 1
Exhibitor Presenter: Doug Osterhout – MuRata
Exhibitor Presenter: David Giuliano – pSemi
Presented By
12:00 PM - 12:30 PM CT
EX - Advanced Passive Components Enabling High-Density PFC and Inverter Architectures in Data Centers
Location: 214C
Exhibitor Presenter: Cathal Sheehan – Bourns Electronics
Presented By
12:00 PM - 12:30 PM CT
EX - Indium Corporation
Location: 214A
Presented By
12:00 PM - 12:30 PM CT
EX - Measurement considerations for power conversion circuits
Location: Expo Theater 3
Exhibitor Presenter: Mike Schnecker – Rohde & Schwarz GmbH & Co. KG
Presented By
12:00 PM - 12:30 PM CT
EX - Scaling Silicon Carbide for High-Power Conversion: Challenges and Solutions
Location: 214B
Exhibitor Presenter: Ghislain R. Ginot (he/him/his) – Cougar Electronics Corp.
Presented By
12:00 PM - 12:30 PM CT
EX - Simplified Thermal Modeling for Power MOSFETs
Location: Expo Theater 4
Exhibitor Presenter: Steven Goldman – Alpha and Omega Semiconductor
Presented By
12:00 PM - 12:30 PM CT
EX - Sinter Pastes for Industry Standard and State-Of-The-Art Power Electronics Assembly
Location: 214A
Exhibitor Presenter: Dean Payne (he/him/his) – Indium Corporation
Presenter By
12:00 PM - 12:30 PM CT
EX - YAGEO Group
Location: Expo Theater 2
Presented By
12:45 PM - 1:15 PM CT
EX - Additive Manufacturing of SiC Components for Semiconductor Processing Equipment
Location: 214A
Exhibitor Presenter: Sangho Chris Park, BS – MADDE Inc.
Presented By
12:45 PM - 1:15 PM CT
EX - AI Data Centres Meet Dynamic Response Systems
Location: 214B
Exhibitor Presenter: Sai Shivareddy – Nyobolt
Presented By
12:45 PM - 1:15 PM CT
EX - Built for the Road Ahead: Thermal, Power and Reliability Breakthroughs in Automotive Packaging Materials
Location: Expo Theater 3
Exhibitor Presenter: Ryan Persons – Heraeus Electronics
Presented By
12:45 PM - 1:15 PM CT
EX - Designing with Hot Swap MOSFETs for AI Datacenters: What Makes Them Different and Why It Matters
Location: Expo Theater 2
Exhibitor Presenter: Joe Jiang – Nexperia B.V.
Exhibitor Presenter: Cole Macias (he/him/his) – Nexperia B.V.
Presented By
12:45 PM - 1:15 PM CT
EX - Percolation in Power Inductors: Silent Performance Shifts Under Thermal and Voltage Stress
Location: Expo Theater 1
Exhibitor Presenter: Efrain Bernal Alzate (he/him/his) – Wurth Elektronik
Presented By
12:45 PM - 1:15 PM CT
EX - Thermal Fatigue-Based Lifetime Prediction Method for IGBT / Power Semiconductor Devices
Location: Expo Theater 4
Exhibitor Presenter: Takuma Sakai – Fuji Electric
Presented By