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    Non-PSMA Session Proposal

    IS06 - The Future of Powering AI

    Tuesday, March 24, 2026
    8:30 AM - 11:55 AM CT

    Presentations:

    • 8:30 AM - 8:55 AM CT
      Density, Efficiency and Transient Response: How to Achieve These in a Compute Dense Rack?

      Industry Session Presenter: Sudhir Kudva, PhD – Nvidia

    • 8:55 AM - 9:20 AM CT
      Power Delivery for High-speed Die to Die Interconnects and Future 3D-ICs

      Industry Session Presenter: Alan Roth – TSMC

    • 9:20 AM - 9:45 AM CT
      Feeding 10000A TPU from +/-400V: Architecture, Challenge, Opportunities

      Industry Session Presenter: Lu Jian – Google

    • 9:45 AM - 10:10 AM CT
      Opportunities and Challenges in Vertical Power Delivery for AI ASICs

      Industry Session Presenter: Shenli Zou – Meta Platforms

    • 10:40 AM - 11:05 AM CT
      Powering AI Chips: Your Last Innovation

      Industry Session Presenter: Sombuddha Chakraborty – Texas Instruments

    • 11:05 AM - 11:30 AM CT
      The Future of Powering AI

      Industry Session Presenter: Gerald Deboy – Infineon Technologies

    • 11:30 AM - 11:55 AM CT
      Efficient Power Delivery Solutions for 5KW GPUs

      Industry Session Presenter: Kaladhar Radhakrishnan, PhD – Intel Corporation