IS06 - The Future of Powering AI

Industry Session Chair(s)

• 

  Minjie Chen, PhD (he/him/his)

  Princeton University
• RP

  Robert C.N. Pilawa-Podgurski

  UC Berkeley

Student Session Assistant(s)

• 

  Rajat Kumar Shukla, PhD (he/him/his)

  Indian Institute of Technology Bombay

Presentations:

• 8:30 AM - 8:55 AM CT

  Density, Efficiency and Transient Response: How to Achieve These in a Compute Dense Rack?
  

  Industry Session Presenter: Sudhir Kudva, PhD – Nvidia
• 8:55 AM - 9:20 AM CT

  Power Delivery for High-speed Die to Die Interconnects and Future 3D-ICs
  

  Industry Session Presenter: Alan S. Roth (he/him/his) – TSMC
• 9:20 AM - 9:45 AM CT

  Feeding 10000A TPU from +/-400V: Architecture, Challenge, Opportunities
  

  Industry Session Presenter: Jian Lu (he/him/his) – Google
• 9:45 AM - 10:10 AM CT

  Opportunities and Challenges in Vertical Power Delivery for AI ASICs
  

  Industry Session Presenter: Shenli Zou – Meta Platforms
• 10:40 AM - 11:05 AM CT

  Powering AI Chips: Your Last Innovation
  

  Industry Session Presenter: Sombuddha Chakraborty – Texas Instruments
• 11:05 AM - 11:30 AM CT

  DC/DC Power Architectures for Next‑Generation AI Server Racks
  

  Industry Session Presenter: Roberto Rizzolatti, PhD (he/him/his) – Infineon Technologies Austria AG

  Co-Author: Gerald Deboy – Infineon Technologies
• 11:30 AM - 11:55 AM CT

  Efficient Power Delivery Solutions for 5KW GPUs
  

  Industry Session Presenter: Kaladhar Radhakrishnan, PhD – Intel Corporation