IS04 - 3D-Power Packaging for AI and its Application in Power Systems Optimization

Industry Session Chair(s)

• 

  Jason Rouse, PhD, MBA

  Taiyo America, Inc.
• 

  Vikas Gupta, PhD

  ASE US, Inc
• JB

  John Bultitude

  Bultitude Consulting LLC

Student Session Assistant(s)

• 

  Mahery Rajemisaona

  Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELab, 38000 Grenoble, France

Presentations:

• 8:30 AM - 8:55 AM CT

  Silicon Capacitors for Improved Power Efficiency and Power Density: From the Grid to the Chip
  

  Industry Session Presenter: Jean-Marc Yannou (he/him/his) – Murata Integrated Passive Solutions
• 8:55 AM - 9:20 AM CT

  Embedded Passives Design for AI Power Delivery
  

  Industry Session Presenter: Sudha Durvasula – Saras Micro Devices
• 9:20 AM - 9:45 AM CT

  How AI/ML Workloads are Transforming Data Center Power and Cooling
  

  Industry Session Presenter: Cheelim Nge (he/him/his) – Google Cloud
• 9:45 AM - 10:10 AM CT

  Power for AI-Data centers
  

  Industry Session Presenter: Bernhard Knott – Infineon
• 10:40 AM - 11:05 AM CT

  Exploring AI/ML in Power Electronics - Component Selection and Converter Topology Optimizations
  

  Industry Session Presenter: Doug C. Hopkins, PhD – NC State University
• 11:05 AM - 11:30 AM CT

  The Silent Enabler: WBG Power Technology & packages for the AI-HPC Revolution
  

  Industry Session Presenter: Jim Honea, PhD – Nexperia

  Co-Author: Andrea Bricconi – Nexperia

  Co-Author: Giuliano Cassataro (he/him/his) – Nexperia
• 11:30 AM - 11:55 AM CT

  Vertical Power Delivery Integration: Benefits and Trade-offs of Moving Beyond PCB Backside to In-package Solutions
  

  Industry Session Presenter: Trey A. Roessig, PhD (he/him/his) – Empower Semiconductor

  Co-Author: Tim Phillips, MBA – Empower Semiconductor