IS07 - Beyond Silicon: Integrated Wide Bandgap Power Solutions for Next-Generation Systems

Wednesday, March 25, 2026

8:30 AM - 11:55 AM CT

Location: 206

Industry Session Chair(s)

8:30 AM - 8:55 AM CT

Utilizing D³GaN capabilities to optimize Automotive Traction Inverter performance and costs in electric vehicles
Industry Session Presenter: Hans B. Winter (he/him/his) – VisIC Technologies Austria GmbH
8:55 AM - 9:20 AM CT

Accelerating GaN Adoption in Motor Drives with Monolithic ICeGaN™ Integration
Industry Session Presenter: Di Chen, M.A.Sc (he/him/his) – Cambridge GaN Devices
9:20 AM - 9:45 AM CT

A novel three-phase power micro-module for robotic hands
Industry Session Presenter: Marco Palma, MSCee MBA (he/him/his) – Efficient Power Conversion
9:45 AM - 10:10 AM CT

Enabling High-Temperature Applications with Monolithic GaN IC Modules
Industry Session Presenter: David Czajkowski, MSc, MBA (he/him/his) – MinDCet NV
10:40 AM - 11:05 AM CT

1250 V and 1700 V GaN Solutions for 800 VDC AI Data Centers
Industry Session Presenter: Andy Smith – Power Integrations
11:05 AM - 11:30 AM CT

High-Power GaN ICs Deliver Leading Efficiency and Power Density in 800V AI Data Center DC-DC Brick Solutions
Industry Session Presenter: Llew Vaughan-Edmunds – Navitas
11:30 AM - 11:55 AM CT

Maximizing GaN Benefits Through Integration
Industry Session Presenter: John Gomez – Texas Instruments
Co-Author: Bing Lu, PhD – TEXAS INSTRUMENTS