IS21 - Power Modules and Packaging

Industry Session Chair(s)

• 

  Frank Cirolia, BSEE

  Advanced Energy
• LH

  Lei Han

  Qorvo

Student Session Assistant(s)

• RK

  Ritankar Kumar (he/him/his)

  IIT Bhubaneswar

Presentations:

• 8:20 AM - 8:45 AM CT

  Enabling miniaturization and higher efficiency in low voltage motor drives through semiconductor integration and flip chip power packaging
  

  Industry Session Presenter: Nicholas Oborny (he/him/his) – Texas Instruments
• 8:45 AM - 9:10 AM CT

  PCB Design Considerations and Stack-up for 40 kVA Assembled Power Modules (700 VDC, 45 A)
  

  Industry Session Presenter: Michael Schleicher (he/him/his) – Semikron Danfoss Elektronik GmbH & Co. KG

  Co-Author: Kevork Haddad (he/him/his) – Semikron Danfoss LLC
• 9:10 AM - 9:35 AM CT

  Ceramics Substrates for Next Generation Heat Dissipation from Electric Devices
  

  Industry Session Presenter: TOMOHIRO KATO (he/him/his) – NORITAKE U.S.A., INC., Industrial Ceramics Department

  Co-Author: Keita Miyajima, Ph.D. (he/him/his) – NORITAKE CO., LIMITED, Sales Department, Ceramics and Material Division
• 9:35 AM - 10:00 AM CT

  Power Electronics Integration and Manufacturing-Power Modules / High Density Design
  

  Industry Session Presenter: HoChieh Jay Yu – ICP Technology

  Co-Author: Jason Huang – Sentec E&E