This paper goes over some of the key advances in semiconductor integration and power packaging to enable further miniaturization and higher efficiency in low voltage motor drives ( < 200V). With the rapid advances in battery technology, the adoption of low voltage motors for a variety of applications has grown drastically over the last decade. From compact power tools to advanced humanoid robotics, battery operated systems tend to drive requirements for lighter weight, higher efficiency, and smaller size in order to extend operating time, reduce form factor, and improve usability. Traditionally, many low voltage, high power motor drive systems rely on discrete power designs in order to satisfy peak current demands and thermal efficiency, but advances in bipolar complementary metal-oxide-semiconductor (BiCMOS) power semiconductor processes and flip chip packaging are enabling further integration of solutions for low voltage, high power motor drives. Key topics covered will be the differences between integrated lateral (MOS/GaN) FET and discrete vertical metal-oxide-semiconductor field-effect transistor (MOSFET) power stages, flip-chip power packaging and thermal management, and integration of motor drive functions such as current sensing, protection, and slew rate controls.
