The acceleration of the development and adoption of AI solutions is driving the need to increase the computing footprint in the data center server rack. With more computing functions present in the rack, there is also a dramatic increase in the required power to enable these AI functions. This presentation will discuss how the data center rack power architecture impacts the performance of the power delivery sub-systems. Four different isolation architecture will be presented: 800 V non-isolated, 800 V isolated, +/-400 V isolated with 3-wire power distribution, and +/-400 V isolated with 2-wire power distribution. For each architecture, seven system-level impacts will be presented and discussed: 3rd harmonic current, power distribution cables, high voltage surge events, creepage and clearance, hold up performance, power supply paralleling, and hot swap. For each impact, the consequences to the power distribution system will be discussed in terms of size, efficiency and overall efficacy. A final summary will be provided that shows the complete TI High Voltage DC (HVDC) power delivery solution.
