AI workloads are driving steep increases in processor power, reaching kilowatt levels in next-gen platforms. Traditional power delivery has its limits, prompting a shift toward novel architectures that balance efficiency, current density, and thermal control.
The presentation provides a comprehensive review of power delivery solutions - from traditional multiphase voltage regulators on the PCB to innovative under, near-chip, and in-package conversion technologies.
With today’s critical shift towards under-package or vertical power delivery, the goal is to demystify the trade-offs associated with each architecture in the context of kilowatt-class processors and review how they align with the requirements of power density, transient performance, and thermals. The session will conclude with a roadmap of architectural directions and a set of recommendations for aligning future power delivery strategies as scalable solutions that can sustain the future of AI compute platforms.
