T19.9 - A Method to Balance Thermal Distribution of Paralleled Press-Pack IGBTs Based on Gradient Copper-Molybdenum Alloy Ratio Layout

Wednesday, March 25, 2026

4:40 PM - 5:00 PM CT

Location: 214C

Technical Lecture Presenter(s)

Suhang Wei

Huazhong University of Science and Technology

Presentation

Co-Author(s)

JL

Jiaxin Liu

Huazhong University of Science and Technology
WL

Weishan Lv

Huazhong University of Science and Technology
YZ

Yuan Zhang

Huazhong University of Science and Technology
CC

Cai Chen

HuaZhong University of Science and Technology
YK

Yong Kang

School of Electrical and Electronic Engineering, Huazhong University of Science and Technology
SD

Siqi Dai

Huazhong University of Science and Technology
XS

Xuchen Sun

Huazhong University of Science and Technology
WJ

Wei Jiang

GAC Aion New Energy Automotive Co., Ltd.
PW

Pengyang Wang

GAC Aion New Energy Automotive Co., Ltd.
BL

Bin Lai

GAC Aion New Energy Automotive Co., Ltd.

Press-pack IGBTs (PP-IGBTs) are widely used due to their high power, double-sided cooling, and ease of series connection. However, the external pressure applied to the large-area boss is not uniform due to uniform strain caused by mismatched thermal expansion coefficients (CTE) between layers. This can lead to issues such as edge warping, concentrated temperature distribution, and chip cracking during operation. This paper proposes a method to replace the traditional pure molybdenum plates with a gradient copper-molybdenum alloy ratio layout. Results show that an appropriate increase the copper ratio in the center of the module can reduce the maximum junction temperature and greatly promote temperature uniformity, but a large gradient will destroy the stress transfer law and make the internal stress too high. This simple and convenient method is suitable for PP IGBT high-power applications and scenarios with good heat dissipation conditions