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Power Silicon MOSFETs, BJTs, IGBTs, etc.

T28.2 - Electro-Thermal-Mechanical Multiphysics Modeling and Characterization of Compliant Press-Pack IGBTs

Thursday, March 26, 2026
8:40 AM - 9:00 AM CT
Location: 214D
Press-pack IGBTs (PPIs) are essential in HVDC systems, where accurate multiphysics analysis is vital for reliability improvement. Depending on the packaging, PPIs are classified into rigid (RPPI) and compliant (CPPI) types. While RPPI multiphysics modeling has been extensively investigated, systematic studies on CPPIs remain limited. This work develops a coupled electro-thermal-mechanical multiphysics model tailored to CPPIs, incorporating detailed material properties and modeling settings. The model is validated against temperature distributions and transient thermal impedance measurements, demonstrating high accuracy. On this basis, the thermo-mechanical stress behavior of CPPIs is analyzed and benchmarked against RPPIs. The results show that thermal cross-coupling causes noticeable chip-to-chip temperature non-uniformity in CPPIs, whereas the compliant spring structure maintains relatively uniform stress by accommodating thermal expansion. Replacing the springs with copper posts in an RPPI configuration lowers the junction temperature but produces more uneven stress and displacement. The research results provide guidance for the reliable design of CPPIs in HVDC applications.