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    Power Modules / High Density Design

    T19.7 - High Power Density Double-Sided Cooled SiC Power Module with Embedded Liquid-Cooled Microcooler

    Wednesday, March 25, 2026
    4:00 PM - 4:20 PM CT
    Location: 214C
    This paper presents the first 1.2 kV, 2.2 mΩ half-bridge SiC power module with double-sided cooling using embedded microchannel coolers (u-Coolers) for automotive traction applications. The laser-cut, co-sintered u-Coolers are integrated into DBC substrates, eliminating thermal interface materials and reducing junction-to-coolant resistance. The module achieves 0.076 K/W at 2 L/min, enabling 3.94 kW heat dissipation at 25 °C coolant, with measured performance of 0.10 K/W at 0.5 L/min, closely matching the simulation. A fixture-assisted assembly process ensures precise alignment and mechanical robustness, while electrical testing confirmed low conduction loss with 2.2 mΩ Rds(on) at 25 °C. Compared to state-of-the-art automotive modules, the proposed design reduces thermal resistance by up to 62.5% and provides a scalable, manufacturable double-sided cooling solution for next-generation high-power-density traction inverters.