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Embedded Technologies, 3D Packaging, and Additive Manufacturing

T19.3 - Increasing Power Density in 48V DC-DC Converters Using Vertically Integrated 3D Glass Power Bricks for Data Center Applications

Wednesday, March 25, 2026
2:10 PM - 2:30 PM CT
Location: 214C
High-performance computing systems increasingly demand for compact and efficient 48 V DC-DC conversion. Conventional flat layouts underutilize vertical space due to tall inductors dictating module height. This work presents a vertically integrated 3D glass-based “power brick” module that stacks FETs, isolation ICs, and peripheral passives within a custom multilayer glass interposer. The interposer, fabricated via selective laser etching with integrated copper routing, enables dense vertical packaging and improves volumetric power density. The module is electrically validated and thermally characterized under natural convection and forced-air cooling. It achieves a 59.7% footprint reduction compared to an equivalent planar implementation, with substantially improved volume utilization at 3.8 mm height. Two power brick modules are implemented in a Fiboncacci 5:1 switched capacitor first stage for a 48-to-1 V converter. With a focus on a compact, height-uniform PCB layout a peak efficiency of 93.1% and power density of 2.15 kW/in³ are achieved.