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PSMA Session
IS04.7 - Vertical Power Delivery Integration: Benefits and Trade-offs of Moving Beyond PCB Backside to In-package Solutions
Tuesday, March 24, 2026
11:30 AM - 11:55 AM
CT
Location: 206
Industry Session Presenter(s)
Trey A. Roessig, PhD (he/him/his)
Empower Semiconductor
Presentation
Co-Author(s)
Tim Phillips, MBA
Empower Semiconductor