D23 - Power Electronics Integration and Manufacturing 1

Technical Dialogue Session Chair(s)

• ZD

  Zhou Dong

  ABB
• 

  Justin Henspeter, MSEE

  IBM
  Iowa State University

Presentations:

• 12:00 PM - 1:45 PM CT

  High-Density Packaging Structure Optimization with Embedded Gate Driver for 3.3 kV SiC MOSFETs
  

  Technical Dialogue Presenter: Yuxiang Chen (she/her/hers) – Univerity of Arkansas

  Co-Author: Liyang Du – University of Arkansas

  Co-Author: Xia Du, PhD – University of Arkansas

  Co-Author: Alan Mantooth, PhD – University of Arkansas
• 12:00 PM - 1:45 PM CT

  Compliance Feasibility Study - A User-Friendly EMC Test Result Simulation and EMI Filtering Solution Design Tool
  

  Technical Dialogue Presenter: Martin Kuo (he/him/his) – ITG Electronics

  Co-Author: Yirui Yang, PhD (he/him/his) – University of Florida

  Co-Author: Qinghui Huang – University of Florida

  Co-Author: Shuo Wang – University of Florida
• 12:00 PM - 1:45 PM CT

  Inverter Leg with Vertical Interconnection and Integrated Shielding: Opportunity for Vertical WBG Power Components
  

  Technical Dialogue Presenter: Mahery Rajemisaona – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELab, 38000 Grenoble, France

  Co-Author: Pierre-Olivier Jeannin, PhD – G2Elab, Université Grenoble Alpes

  Co-Author: Vincent Bley – LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France

  Co-Author: Mickael Petit – Institut Lafayette, Metz, France

  Co-Author: Fabien Ndagijimana – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2ELab, 38000 Grenoble, France
• 12:00 PM - 1:45 PM CT

  EMI Filter Design for Electric Vehicle with PCB-Integrated Capacitors
  

  Technical Dialogue Presenter: Genzhai Peng – Xidian University

  Co-Author: Yu Zhang – Xidian University
• 12:00 PM - 1:45 PM CT

  Frequency-Domain Based EMI Analysis and Prediction for Interleaved TCM and Integrated TCM (iTCM) PFC Converters
  

  Technical Dialogue Presenter: Yusheng Chen – Delta Electronics (America) Ltd.

  Co-Author: Tyler McGrew – Center for Power Electronics Systems, Virginia Tech

  Co-Author: Zhehui Guo, PhD (he/him/his) – Delta Electronics (America) Ltd.

  Co-Author: Ripun Phukan, PhD (he/him/his) – Delta Electronics

  Co-Author: Peter Barbosa, PhD – Delta Electronics
• 12:00 PM - 1:45 PM CT

  Binder Jet Printed Ferrite Cores and Lithographically Printed Ceramic Bobbins for Power Conversion
  

  Technical Dialogue Presenter: Sam Mahmodicherati (he/him/his) – GE Aerospace

  Co-Author: Ramanujam Ramabhadran, PhD – GE Aerospace

  Co-Author: Jiale Xu – Stanford University

  Co-Author: Juan Rivas-Davila – Stanford University

  Co-Author: Cathleen Hoel – GE Aerospace
• 12:00 PM - 1:45 PM CT

  Short-Circuit Failure Mode Mechanical Readiness of SiC Press-Pack Packages
  

  Technical Dialogue Presenter: Youssef Abotaleb – University of Nebraska-Lincoln

  Co-Author: Ekaterina Muravleva – University of Nebraska-Lincoln

  Co-Author: Jun Wang, PhD – University of Nebraska–Lincoln
• 12:00 PM - 1:45 PM CT

  Study of Electric and Magnetic Near-Fields from a Half-Bridge Converter and Their Impacts on Conducted Emissions in Other Devices
  

  Technical Dialogue Presenter: Jeet Panchal, M.Sc – Virginia Tech

  Co-Author: Mamoru Sasaki – CPES, Virginia Tech

  Co-Author: Tim Thacker – CPES, Virginia Tech

  Co-Author: Majid Manteghi – ECE, Virginia Tech

  Co-Author: Dong Dong – Virginia Polytechnic Institute and State University

  Co-Author: Rolando Burgos – Virginia Tech