The explosive growth of AI workloads is driving a fundamental rearchitecture of data center power delivery. With rack densities now exceeding 1MW, system-level optimization is required at every conversion stage—from high-voltage (HV) of 800V/±400V distribution to sub-1V core rails. This presentation highlights Analog Devices’ comprehensive Grid-to-Core portfolio, starting with reliable hotplugable frontend, spanning HV intermediate bus converter (IBC) architectures through high-power/high-density point-of-load solutions. We examine HV IBC topologies and x-Brick modules delivering greater than 98% efficiency, along with intelligent power throttling and system sequencing that enable safe live insertion at elevated bus voltages. Across the portfolio, ADI advanced technologies of monolithic IC, proprietary coupled-inductor and silent-switcher enhance the super-high-power-density and ultra-fast-transient power demanding of next-generation AI accelerators.
