"How should a circuit designer make sense of the variety of packages available - and emerging - for GaN and SiC wide-bandgap power switches? With the shift to WBG, the package is no longer just a housing; it is a critical component. There are options for top-side or bottom-side cooling, copper clip or wire-bond internal connections, and thermal pads with widely different surface areas, in addition to the basic choice of surface-mount or through-hole devices. From these options, are industry standards emerging? And if so, which packages are best suited for which applications?
In this talk, we will compare technical characteristics related to thermal and electrical performance, as well as adoption rates, of these package types. Examples are drawn from Nexperia’s existing and coming portfolios of GaN and SiC power switches."
