As electrification accelerates across the automotive sector, power electronics face unprecedented demands for higher power density, superior thermal performance, and uncompromising reliability. This special session explores how packaging materials and architectures must evolve to support wide bandgap (WBG) devices and next generation automotive and industrial power modules. Attendees will gain expert insight into material innovations—from large area sinter pastes and high-performance solder preforms for module attach to advanced die top systems as clipless alternatives—that deliver reliability across extreme operating environments. The session highlights how next generation packaging materials are enabling stable, efficient, and scalable performance for the vehicles of tomorrow.
