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    Stephanie W. Butler, PhD, PE

    WattsButler LLC

    Stephanie Watts Butler, PhD, PE, is the President of WattsButler LLC, an innovation services company focused on the semiconductor industry. As a Technology Innovation Architect with over 35 years of experience in silicon and wide bandgap technology and product development, Dr. Butler enables clients to innovate more efficiently, effectively, and profitably. Dr. Butler can help ensure technology success by analyzing a client’s core competencies, summarizing the competitive landscape, defining and driving technology roadmaps, and identifying critical supplier and joint development opportunities. Dr. Butler can help solve problems with existing processes and products by identifying root-cause technology issues, performing risk assessments, and streamlining inefficient business processes.
    Most recently, Dr. Butler focused on bringing wide bandgap, high voltage and isolation technology innovations from concept to revenue by leading partnerships among technology organizations, manufacturing sites, equipment and materials suppliers, universities and consortia, and product development teams. She is responsible for creating successful system-in-package power solutions and higher current interconnect technologies. Dr. Butler is the Power Electronics Magazine Industrial Deputy Editor-in-Chief, a PELS Member-at-Large, Industry Committee Chair, PELS WIE member, and a contributor to ITRW. She serves on the APEC Conference committee and PSMA Semiconductor committee. She is the past Chair and co-founder of JEDEC's JC-70 Committee for Wide Bandgap Power Electronic Conversion Semiconductors and the current Co-convenor of IEC’s new TC47/WG8: Wide bandgap technologies. Dr. Butler is past vice chair of PowerAmerica’s Membership Advisory Committee. She is a Fellow of the AVS, and a Senior Member of IEEE. SWE honored Dr. Butler with their highest award, the Achievement Award for Outstanding Technical Contributions. During her career at Texas Instruments, she produced innovations in the areas of control, fault detection, metrology, power and CMOS process and package technology, processing equipment, materials, reliability, R&D management, manufacturing science, and new product development generating 17 U.S. patents.

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