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    Doug C. Hopkins, PhD

    NC State University

    Professor Douglas C. Hopkins, Ph.D. has been with the Department of Electrical and Computer Engineering at North Carolina State University since 2011, directs the Laboratory for Packaging Research in Electronic Energy Systems (PREES), is an affiliate faculty with the Center for Additive Manufacturing and Logistics (CAMAL), and received his Ph.D. from Virginia Tech (1989). He held Visiting Faculty appointments with the Army, NASA, Lawrence Livermore, and the Ohio Space Institute, was a reviewer with the Nat’l Academy of Sciences, co-founded DensePower, LLC as president and CTO, and has published over 200 journal, conference, and technical articles. His early career was at the R&D centers of General Electric and Carrier Air-Conditioning companies. His primary research is in very high frequency, high density power electronic systems using wide bandgap (WGB) semiconductors. His research also focuses on the 3D Heterogeneous Integration and physical packaging starting at the die level from high to low power in ceramics, organics, and recently glass module systems. Dr. Hopkins founded/cofounded the: IEEE EPS/PELS joint Power Packaging Committee (1994), Int’l Wksp on Integrated Power Packaging (IWIPP, 1998), IEEE/IMAPS/PSMA “Int’l Symp. on 3D Power Electronics Integrations and Manufacturing” (3D-PEIM, 2016), and the IMAPS “International Symposium on Advanced Power Electronics Packaging (APEPS, 2021). He received the IMAPS Outstanding Educator Award (2013), is an IMAPS Fellow (2007) and was member of the IMAPS Executive Council (2019-2022). He also chairs the IEEE-EPS Power & Energy TC (2022-) and co-chairs the IEEE Heterogeneous Integration Roadmap “Integrated Power Electronics” (Chapter 10) technical working group (2016-).

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