Indium Corporation
As the product manager for semiconductor assembly materials, Dean Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials.
EX - Sinter Pastes for Industry Standard and State-Of-The-Art Power Electronics Assembly
Wednesday, March 25, 2026
12:00 PM - 12:30 PM CT