IS01 - What Is the Next Killer Application for Wide Bandgap Semiconductors?

Industry Session Chair(s)

• TM

  Timothy McDonald

  Power Q Consulting, Inc.
• 

  Peter Di Maso, MBA

Student Session Assistant(s)

• YL

  Yang Li (she/her/hers)

  KU Leuven - Energyville

Presentations:

• 8:30 AM - 8:55 AM CT

  Bi-Directional Switches (BDS): enabling the next killer app for wide bandgap semiconductors
  

  Industry Session Presenter: Michael J. Harrison – Enphase
• 8:55 AM - 9:20 AM CT

  Maximizing MVHV SiC Performance and Reliability with Advanced Power Device and Packaging Technologies for Mission-Critical Energy Infrastructure Applications
  

  Industry Session Presenter: Sumit Jadav – Navitas Semiconductor
• 9:20 AM - 9:45 AM CT

  Combo IceGaN (GaN-IGBT hybrid) revolutionizes performance in EV traction inverters
  

  Industry Session Presenter: David Miller (he/him/his) – Cambridge GaN Devices
• 9:45 AM - 10:10 AM CT

  Powering Precision: The Wide Bandgap Revolution in Electrosurgery
  

  Industry Session Presenter: Phelim Bradley, MEng – Advanced Energy Ltd.
• 10:40 AM - 11:05 AM CT

  New Killer App for Wide Bandgap: AI Datacenters
  

  Industry Session Presenter: Chris Lee – Power Integrations

  Industry Session Presenter: Chris Umminger
• 11:05 AM - 11:30 AM CT

  IS01.6 The Role of SiC in Enabling Efficient and Compact Next-Generation Power Conversion Systems for PV and BESS Application
  

  Industry Session Presenter: Suresh Thangavel, ME in Power Electronics and Drives (he/him/his) – Infineon Technologies AG
• 11:30 AM - 11:55 AM CT

  AI Datacenter Power Architecture with High-Voltage Bi-Diectional and Low-Voltage GaN devices
  

  Industry Session Presenter: Marco Ruggeri, MS (he/him/his) – Renesas