IS13 - New Era of Power Technologies, Devices, Topologies and Applications

Industry Session Chair(s)

• 

  Davide Giacomini (he/him/his)

  Infineon
• 

  Kamal Varadarajan, PhD

  Power Integrations

  Presentation

Student Session Assistant(s)

• RS

  Reza Shahbazi (he/him/his)

  The Pennsylvania State University

Presentations:

• 1:30 PM - 1:55 PM CT

  Reverse Recovery Revisited for Wide-Bandgap Power transistors
  

  Industry Session Presenter: Eric Persson (he/him/his) – Infineon Technologies Americas Corp
• 1:55 PM - 2:20 PM CT

  Leap Ahead with GaN Bidirectional Switches
  

  Industry Session Presenter: Davide Bisi, PhD – Renesas
• 2:20 PM - 2:45 PM CT

  Advancements in SiC Power Devices: Device Design Roadmap to Next-Generation Energy and AI Applications
  

  Industry Session Presenter: Shesh Mani Pandey – Microchip
• 2:45 PM - 3:10 PM CT

  1250 V GaN HEMTs for High-Voltage AI Datacenter Architecture
  

  Industry Session Presenter: Kamal Varadarajan, PhD – Power Integrations
• 3:40 PM - 4:05 PM CT

  GaN High Power Modules – next level in Efficient & Ecological BEV Inverter Applications
  

  Industry Session Presenter: Hans B. Winter (he/him/his) – VisIC Technologies Austria GmbH
• 4:05 PM - 4:30 PM CT

  Next generation inductive isolation based Solid State Relays open new electronic switching applications
  

  Industry Session Presenter: Srivatsa Raghunath – Infineon Technologies
• 4:30 PM - 4:55 PM CT

  Benefits of integrated ZCD / ZVD feature in GaN devices for Triangular Current Mode (TCM) Totem Pole PFC
  

  Industry Session Presenter: Subhransu Satpathy (he/him/his) – Texas Instruments

  Co-Author: Nanditha Reddy Moole – Texas Instruments