Skip to main content
APEC 2026 Main banner

    Embedded Technologies, 3D Packaging, and Additive Manufacturing

    T19.5 - Optimization of GaN-Based High-Current Low-Voltage Two-Stage Converter with Fully 3D Embedded Structure

    Wednesday, March 25, 2026
    2:50 PM - 3:10 PM CT
    Location: 214C
    This paper presents a cascaded two stage DC-DC converter realized with lateral PCB substrate and translated to an 3D embedded heterogeneous structure to vertical power delivery. This converter uses a 48V-5V first stage hybrid switch capacitor converter and a 2nd stage 5V-1V high current interleaved 4-phase buck converter targeting a 48V-1V/100A operation. Optimization in the lateral design along with an electrothermal co-design methodology is used to create a low parasitic inductance vertical power loop of 0.81 nH and a proposed embedded PCB structure with an optimized vertical thermal path. Ultimately, this 3D implementation aims to decrease Z axis height by more than 50% (4.5 mm) when compared to commercial solutions. The design methodology flowchart will be implemented to optimized for maximum junction temperature and high efficiency