With the exponentially increasing AI workloads, datacenters are going to require megawatt-class racks and 800 VDC backbones designed with power electronics proven to support this high power-density with best-in-class lifecycle reliability. Mitsubishi Electric has the wide bandgap power modules to meet and surpass those needs. We connect the dots across the entire datacenter facility. This session will discuss our SBD-embedded 3.3kV+ Unifull™ SiC for ultra low-loss power conversion, as well as the X-series HVIGBT modules spanning from 1.7kV to 6.5kV. Additionally, practical applications will be considered for Full-SiC DXE modules, 8th Gen IGBT and the latest SiC technologies. The session will showcase all the latest power semiconductor advancements that are most pertinent to AI datacenter applications. For any and all UPS, SST, ATS, or PDU applications, Mitsubishi Electric offers powerful and efficient solutions for datacenter rack architectures using 480VAC, 800 VDC, and even much higher. Join our seminar to catch up on the latest developments in SiC and IGBT power module technology designed for the entire AI datacenter ecosystem.
