Infineon
Bernhard Knott, Vice President Backend Innovation at Infineon Technologies AG, started his career within the Semiconductor Industry after receiving his Diploma in Physics from the University of Regensburg in 1997 in developing an embedded NVM Technology. During the following time he held several Management Position in Frontend Technology dealing with BiCMOS Technologies, Sensors and Innovation projects. In 2013 he joined the Backend Organization, first as Head of Package Development for Sensors and Waferlevel, later as Head of the Innovation group. Since then he was responsible for new Package Concepts, innovative Materials, Simulation and Virtual Prototyping as well as the Development for Molded Power Modules. With the fast growing and extremly dynamic market for AI and the multifaceted Challanges within, he is now heading a Backend focused Programm for Powering AI.
IS04.4 - Power for AI-Data centers
Tuesday, March 24, 2026
9:45 AM - 10:10 AM CT