Exhibitor Presentations

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Tuesday, March 24, 2026
1:30 PM - 2:00 PM CT
EX - Analog Devices' System Solutions from 800V/±400V Bus to Sub-1V Core
Location: Expo Theater 3
Exhibitor Presenter: Utkarsh Kavimandan
Presented By
1:30 PM - 2:00 PM CT
EX - Compact, high-efficiency LED driver with CCM PFC and QR 2-Switch Flyback topology using 700V smart power GaN OmniGaNTM
Location: Expo Theater 2
Exhibitor Presenter: Rosario Attanasio (he/him/his) – STMicroelectronics
Exhibitor Presenter: Gianni Vitale, MD – STMicroelectronics
Presented By
1:30 PM - 2:00 PM CT
EX - Custom, Cost-Optimized Powder Core Design for High-Power Inductors
Location: 214D
Exhibitor Presenter: Chris Turocy – Magnetics
Presented By
1:30 PM - 2:00 PM CT
EX - De-risking Inverter-based Resources with Real-time Simulation of Power Electronic Converters and HIL Testing
Location: 214C
Exhibitor Presenter: Kurtis Toews, Peng (he/him/his) – RTDS Technologies Inc.
Presented By
1:30 PM - 2:00 PM CT
EX - End-to-End With GaN from EPC
Location: 217B
Exhibitor Presenter: Alex Lidow, PhD – Efficient Power Conversion
Presented By
1:30 PM - 2:00 PM CT
EX - New Python Integration with SIMetrix/SIMPLIS used to Demonstrate Expanded Capability to Predict GaN and SiC MOSFET Switching Losses in SIMPLIS
Location: 214A
Exhibitor Presenter: Matthew Fortin – SIMPLIS Technologies
Presented By
1:30 PM - 2:00 PM CT
EX - ON-ON & ON-OFF operation mode, Ultra small and highly efficient Isolated TriMagiC Converter™
Location: 217A
Exhibitor Presenter: Mitsunao Fujimoto (he/him/his) – Diamet Corporation
Presented By
1:30 PM - 2:00 PM CT
EX - Reimagining Data Center Power Architecture
Location: Expo Theater 1
Exhibitor Presenter: Pradeep Shenoy, PhD – Texas Instruments
Presented By
1:30 PM - 2:00 PM CT
EX - Renesas Energy and Datacenter Power Solutions
Location: Expo Theater 4
Exhibitor Presenter: Pietro Scalia (he/him/his) – Renesas Electronics
Presented By
1:30 PM - 2:00 PM CT
EX - SiC Power MOSFETs from Bosch
Location: 214B
Exhibitor Presenter: Johannes Maximilian Meckbach
Presented By
2:15 PM - 2:45 PM CT
EX - A Thermally Enhanced Isolated TO-247 Package using Ceramic DBC Runs Cooler and Improves System Power Density
Location: 214B
Exhibitor Presenter: Lawrence Mazer – Luminus Devices, Inc.
Presented By
2:15 PM - 2:45 PM CT
EX - Fast Out of the Gate: Measuring Gate Driver Performance in SiC Systems
Location: 214A
Exhibitor Presenter: Bill Driver, Masters of Business Administration – Tektronix
Exhibitor Presenter: Kevin Hermanns – PE-Systems GmbH
Exhibitor Presenter: Eugen Stumpf, Dipl-Ing, MBA (he/him/his) – TAMURA Corporation
Presented By
2:15 PM - 2:45 PM CT
EX - From Data Centers to Wearables: Research Directions at the Power Management Integration Center
Location: 214D
Exhibitor Presenter: Jason Stauth – Dartmouth College
Exhibitor Presenter: Charlie Sullivan
Exhibitor Presenter: Hanh-Phuc Le – University of California-San Diego
Presented By
2:15 PM - 2:45 PM CT
EX - From general purpose to purpose-built: how application-optimized silicon power MOSFETs boost overall system performance
Location: Expo Theater 4
Exhibitor Presenter: Matthias Trattler (he/him/his) – Infineon Technologies Austria AG
Presented By
2:15 PM - 2:45 PM CT
EX - High-energy Ion Implantation & Electron irradiation services
Location: 217A
Exhibitor Presenter: Thoralf Gebel
Presented By HZDR Innovation GmbH
2:15 PM - 2:45 PM CT
EX - Parasitic in Push-pull transformers: How Interwinding Capacitance and Leakage Inductance Drive EMI/EMC Results on Auxiliary Power Supplies
Location: Expo Theater 1
Exhibitor Presenter: Vidal Gonzalez – Wurth Elektronik
Presented By
2:15 PM - 2:45 PM CT
EX - Powering Megawatt-Class Racks for AI Datacenters with Wide Bandgap and Next-Gen Power Modules
Location: Expo Theater 2
Exhibitor Presenter: Mark Steiner – Mitsubishi Electric US
Presented By
2:15 PM - 2:45 PM CT
EX - Technologies Powering the Shift to Solid-State Transformers: How TDK Technologies Enable the Transition
Location: Expo Theater 3
Exhibitor Presenter: Anirban Roy, Bachelor of Engineering (B.Eng.), Electrical and Electronics – TDK Corporation
Presented By
2:15 PM - 2:45 PM CT
EX - VAC Magnetics, LLC
Location: 214C
Presented By
3:00 PM - 3:30 PM CT
EX - DEWESoft LLC
Location: Expo Theater 4
Presented By
3:00 PM - 3:30 PM CT
EX - Dry Film Capacitors for Next-Generation Power Electronics Applications
Location: Expo Theater 2
Exhibitor Presenter: Joseph Bond – Electronic Concepts, Inc.
Presented By
3:00 PM - 3:30 PM CT
EX - Interfacing to Current Transformers
Location: Expo Theater 1
Exhibitor Presenter: George A. Slama – Wurth Elektronik
Presented By
3:00 PM - 3:30 PM CT
EX - New generation high power density MHz power inductor for GPU VRM application
Location: 214C
Exhibitor Presenter: Qing Lu – Zhejiang ThanTech Technology Co.,Ltd
Presented By
3:00 PM - 3:30 PM CT
EX - Packages for Wide-Bandgap Power Switches – the Emerging Landscape
Location: 214B
Exhibitor Presenter: Jim Honea, PhD – Nexperia
Presented By
3:00 PM - 3:30 PM CT
EX - Saras Micro Devices Introduction - Powering AI with STILE
Location: 214A
Exhibitor Presenter: Bart Deprospo – Saras Micro Devices
Exhibitor Presenter: Jose Solis-Camara
Presented By
3:00 PM - 3:30 PM CT
EX - SimpleChips and the Amazing High-Voltage Monitor 18SCT005
Location: 214D
Exhibitor Presenter: Alain Comeau, M.Sc. Physics – SimpleChips Technology Inc.
Presented By
3:45 PM - 4:15 PM CT
EX - A Case Study: The Influence of Gate Driver Dynamics on Power Topology Simulation with PLECS
Location: 214B
Exhibitor Presenter: Didier Balocoo – Onsemi
Presented By
3:45 PM - 4:15 PM CT
EX - EMI Optimization of a Buck Converter
Location: Expo Theater 1
Exhibitor Presenter: Octavian-Tudor Stroe, MSc – Wurth Elektronik
Presented By
3:45 PM - 4:15 PM CT
EX - From Grid to Rack: The Rise of Solid State Power Distribution Powered by CoolSiC™ JFET
Location: Expo Theater 4
Exhibitor Presenter: Elijah Fagbemi (he/him/his) – Infineon Technologies Austria AG
Presented By
3:45 PM - 4:15 PM CT
EX - GaN and the 800V AI Data Center Architecture PDB
Location: Expo Theater 2
Exhibitor Presenter: Jeff Halbig – STMicroelectronics
Presented By
3:45 PM - 4:15 PM CT
EX - Power Semiconductors - The silent Heroes of the power Grid
Location: 214A
Exhibitor Presenter: Tobias Keller – Hitachi Energy Ltd
Presented By
3:45 PM - 4:15 PM CT
EX - Tower’s Power Management Technologies: Achieving Highest System Efficiency & Integration
Location: Expo Theater 3
Exhibitor Presenter: Mete Erturk – Tower Semiconductor
Presented By
Wednesday, March 25, 2026
12:00 PM - 12:30 PM CT
EX - MEMS-Based HV Smart Circuit Protection
Location: 214D
Exhibitor Presenter: John Mookken
Exhibitor Presenter: Michael House, MS, MBA – Siemens Government Technologies
Presented By
12:00 PM - 12:30 PM CT
EX - Multi-Level Converters for Battery Charging
Location: Expo Theater 1
Exhibitor Presenter: Doug Osterhout
Exhibitor Presenter: David Giuliano – pSemi
Presented By
12:00 PM - 12:30 PM CT
EX - Advanced Passive Components Enabling High-Density PFC and Inverter Architectures in Data Centers
Location: 214C
Exhibitor Presenter: Cathal Sheehan – Bourns Electronics
Presented By
12:00 PM - 12:30 PM CT
EX - Indium Corporation
Location: 214A
Presented By
12:00 PM - 12:30 PM CT
EX - Rohde & Schwarz USA, Inc.
Location: Expo Theater 3
Presented By
12:00 PM - 12:30 PM CT
EX - Scaling Silicon Carbide for High-Power Conversion: Challenges and Solutions
Location: 214B
Exhibitor Presenter: Ghislain R. Ginot (he/him/his) – Cougar Electronics Corp.
Presented By
12:00 PM - 12:30 PM CT
EX - Simplified Thermal Modeling for Power MOSFETs
Location: Expo Theater 4
Exhibitor Presenter: Steven Goldman – Alpha and Omega Semiconductor
Presented By
12:00 PM - 12:30 PM CT
EX - Sinter Pastes for Industry Standard and State-Of-The-Art Power Electronics Assembly
Location: 214A
Exhibitor Presenter: Dean Payne – Indium Corporation
Presenter By
12:00 PM - 12:30 PM CT
EX - YAGEO Group
Location: Expo Theater 2
Presented By
12:45 PM - 1:15 PM CT
EX - Additive Manufacturing of SiC Components for Semiconductor Processing Equipment
Location: 214A
Exhibitor Presenter: Sangho Chris Park, BS – MADDE Inc.
Presented By
12:45 PM - 1:15 PM CT
EX - AI Data Centres Meet Dynamic Response Systems
Location: 214B
Exhibitor Presenter: Sai Shivareddy – Nyobolt
Presented By
12:45 PM - 1:15 PM CT
EX - Built for the Road Ahead: Thermal, Power and Reliability Breakthroughs in Automotive Packaging Materials
Location: Expo Theater 3
Exhibitor Presenter: Ryan Persons – Heraeus Electronics
Presented By
12:45 PM - 1:15 PM CT
EX - Designing with Hot Swap MOSFETs for AI Datacenters: What Makes Them Different and Why It Matters
Location: Expo Theater 2
Exhibitor Presenter: Joe Jiang – Nexperia B.V.
Exhibitor Presenter: Cole Macias (he/him/his) – Nexperia B.V.
Presented By
12:45 PM - 1:15 PM CT
EX - Percolation in Power Inductors: Silent Performance Shifts Under Thermal and Voltage Stress
Location: Expo Theater 1
Exhibitor Presenter: Efrain Bernal Alzate (he/him/his) – Wurth Elektronik
Presented By
12:45 PM - 1:15 PM CT
EX - Thermal Fatigue-Based Lifetime Prediction Method for IGBT / Power Semiconductor Devices
Location: Expo Theater 4
Exhibitor Presenter: Takuma Sakai – Fuji Electric
Presented By