This paper investigates the mechanical capability of SiC FET press-pack (PP) modules to achieve short-circuit failure mode (SCFM) for uninterrupted operation in high-availability, high-voltage (HV) applications, including HVDC transmission for data centers, aerospace, EV charging, and medical equipment. By understanding the failure mechanism of SiC dies, a power-dense press-pack (PP) module can be equipped with a redundant fail-short design, eliminating external crowbars that add cost, bulk, and limited protection. Unlike Si dies, SiC dies neither melt nor break under high-temperature inductive short circuits, potentially leading to unpredictable module explosions. This work primarily explains how sintered dies in a four-leg monolithic spring mechanically fail during short circuits and proposes a promising packaging design to enable SCFM. Modeling, simulation, fabrication, and experimental validation have been substantially completed, with full results to be presented in the final paper.
