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Device and Component Modeling

T27.3 - Design and Integration of a Novel Insulated NTC Thermistor for Enhanced Temperature Sensing in Power Modules

Thursday, March 26, 2026
9:00 AM - 9:20 AM CT
Location: 214C
Accurate temperature monitoring within power modules is critical for ensuring the reliability of power semiconductor devices. Conventional glass-encapsulated negative temperature coefficient (NTC) thermistors require separate copper pads for electrical insulation, restricting their placement near switching components like power semiconductor bare dies. This spatial separation degrades thermal coupling, reducing sensing accuracy and response speed. This study proposes a novel electrically insulated NTC thermistor and its integration method into power modules, enabling direct placement near power semiconductor bare dies. Three-dimensional finite element thermal simulations demonstrate that this approach significantly improves thermal response, reducing the thermal time constant by 0.235 seconds compared to conventional implementations. Thermal cycling tests and scanning acoustic tomography (SAT) inspections confirm the structural and mechanical reliability of the embedded thermistor. Additional experimental data will be included in the final manuscript.