T37 - Power Module Integration and Measurement

Technical Lecture Session Chair(s)

• 

  Wensong Yu, PhD

  NC State Univeristy
• 

  Lei Wang

  Renesas

Student Session Assistant(s)

• 

  Yuzhou Yao (he/him/his)

  The Ohio State University

Presentations:

• 10:20 AM - 10:40 AM CT

  Low-Profile Vertical Shunt Resistor Integration in High-Current Power Modules
  

  Technical Lecture Presenter: Thiyu S. Warnakulasooriya, MEng (he/him/his) – Nagoya University

  Co-Author: Jiyoon Choi, MA (she/her/hers) – Nagoya University

  Co-Author: Sihoon Choi, PhD (he/him/his) – Nagoya University

  Co-Author: Jun Imaoka – Nagoya University

  Co-Author: Masayoshi Yamamoto – Institute of Materials and Systems for Sustainability, Nagoya University

  Co-Author: Leonard Henrichs – Isabellenhütte Heusler GmbH & Co. KG

  Co-Author: Jan Ückerseifer – Isabellenhütte Heusler GmbH & Co. KG

  Co-Author: Jan Marien – Isabellenhütte Heusler GmbH & Co. KG
• 10:40 AM - 11:00 AM CT

  Vertical Shunt Resistor for Double-Sided Cooling Power Modules
  

  Technical Lecture Presenter: Sihoon Choi, PhD (he/him/his) – Nagoya University

  Co-Author: Thiyu S. Warnakulasooriya, MEng (he/him/his) – Nagoya University

  Co-Author: Jiyoon Choi, MA (she/her/hers) – Nagoya University

  Co-Author: Jun Imaoka – Nagoya University

  Co-Author: Masayoshi Yamamoto – Institute of Materials and Systems for Sustainability, Nagoya University

  Co-Author: Keishi Nakamura – KOA Corporation

  Co-Author: Susumu Toyoda – KOA Corporation

  Co-Author: Koji Shigesawa – KOA Corporation
• 11:00 AM - 11:20 AM CT

  SiC Power Device Condition Monitoring with On-Chip In-Driver 2-D Multi-Level Tᴏɴ Delay Measurement
  

  Technical Lecture Presenter: Prosenjit Kumar Ghosh (he/him/his) – UT Dallas

  Co-Author: Fei Zhou (he/him/his) – The University of Texas at Dallas

  Co-Author: Brian Ma (he/him/his) – University of Texas at Dallas
• 11:20 AM - 11:40 AM CT

  Innovative Patterning Technology for Advanced Packaging and Power Electronics Applications
  

  Technical Lecture Presenter: Poulomi Mukherjee – Applied Materials Inc.

  Co-Author: Kelvin Chan – Applied Materials Inc.

  Co-Author: Howard Kao – Applied Materials Inc.

  Co-Author: Kartik Ramaswamy – Applied Materials Inc.

  Co-Author: Alan May – Applied Materials Inc.

  Co-Author: Loic Constantin – Applied Materials Inc.

  Co-Author: Sarah Wozny – Applied Materials Inc.
• 11:40 AM - 12:00 PM CT

  Design of a 6.5 kV SiC MOSFET Full-Bridge Module
  

  Technical Lecture Presenter: Max Rogers – The University of Alabama

  Co-Author: Andrew N. Lemmon, PhD – University of Alabama

  Co-Author: Arthur Boutry – The University of Alabama

  Co-Author: Nick Baker – The University of Alabama

  Co-Author: Nicholas Turner – The University of Alabama