Silver sinter has emerged as a key die attach technology for wide-band-gap power electronics. The high conductivity, both thermal and electrical, plus the ability to withstand operating temperatures in excess of 200oC, has seen silver sinter become the material of choice for SiC die attach in power electronics. As these wide band gap power devices become more mainstream, an emphasis shifts to cost reduction. Copper is fast gaining momentum in this space as it can offer similar performance with respect to thermal and electrical conductivity, at a lower cost. This presentation showcases copper sinter pastes for both pressure-less and pressure assisted processes. A case study compares pressure-less copper sinter with multiple pressure-less silver sinter materials for SiC die attach in industry standard TO-247 package. Also featured are pressure-assisted copper sinter pastes for different applications in state-of-the-art and emerging power electronics assembly, including die attach sintering on ceramic substrates and large area or substrate attach sintering to the heatsink.
