Cryogenic power electronics are increasingly vital for electric aviation and aerospace applications, where low-temperature operation enables higher efficiency and power density. However, ensuring reliable performance at cryogenic temperatures remains a critical challenge. Effective switching of power semiconductors requires minimized gate driver loop inductance, necessitating the placement of gate drivers near the devices within cryogenic environments. Consequently, the performance of gate drivers under such conditions is of paramount importance. This digest evaluates the cryogenic performance of several commercial-off-the-shelf (COTS) gate driver ICs, employing capacitive, magnetic, and optical coupling technologies at temperatures as low as 30 K. Preliminary results reveal that the capacitive- and magnetic-coupling candidates can function at cryogenic temperature, while the optical-coupling part stops operating below 120 K. The magnetic- and capacitive-coupling parts exhibit smaller propagation delay at low temperature while the optical-coupling part shows the opposite trend.
